Three Dimensional Shape Measurement of Via-Holes for the Production of Multi-Layers Circuit Boards

MIYASHITA HIROAKI; KANADA HAJIME; OGAWA TAKEHIKO

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J-GLOBAL ID：200902265688547771 Reference number：04A0526183

Three Dimensional Shape Measurement of Via-Holes for the Production of Multi-Layers Circuit Boards

多層回路板製造工程におけるビアホールの3次元形状計測

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Material：
Volume： 7 Issue： 4 Page： 333-338 Publication year： Jul. 01, 2004
JST Material Number： S0579C ISSN： 1343-9677 Document type： Article
Article type：原著論文 Country of issue： Japan (JPN) Language： JAPANESE (JA)

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Printed circuits , Measurement of geometric and mechanical quantities in general , Numerical computation

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