Low-k SiOCH Film Deposited by Plasma-Enhanced Chemical Vapor Deposition Using Hexamethyldisiloxane and Water Vapor

SHIOYA Yoshimi; SHIMODA Haruo; MAEDA Kazuo; OHDAIRA Toshiyuki; SUZUKI Ryoichi; SEINO Yutaka

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J-GLOBAL ID：200902270627433521 Reference number：05A0605984

Low-k SiOCH Film Deposited by Plasma-Enhanced Chemical Vapor Deposition Using Hexamethyldisiloxane and Water Vapor

ヘキサメチルジシロキサンと水蒸気を用いたプラズマ支援化学気相蒸着法によって堆積した低誘電率SiOCH薄膜

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Material：
Volume： 44 Issue： 6A Page： 3879-3884 Publication year： Jun. 15, 2005
JST Material Number： G0520B ISSN： 0021-4922 Document type： Article
Article type：短報 Country of issue： Japan (JPN) Language： ENGLISH (EN)

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Techniques and equipment of thin film deposition , Semiconductor thin films

Reference (17)：

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