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J-GLOBAL ID：200902278041928727
Reference number：05A0538208
Low-Damage Damascene Patterning Using Porous Inorganic Low-Dielectric-Constant Materials
多孔質無機低誘電定数材料を用いた低損傷ダマスカスパターン形成
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Author (5)：
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Material：
Volume：
44
Issue：
5A
Page：
2976-2981
Publication year：
May. 15, 2005
JST Material Number：
G0520B
ISSN：
0021-4922
Document type：
Article
Article type：
原著論文
Country of issue：
Japan (JPN)
Language：
ENGLISH (EN)
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Manufacturing technology of solid-state devices
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Reference (8)：
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1) Y. H. Kim, S. K. Lee and H. J. Kim: J. Vac. Sci. & Technol. A <B>18</B> (2000) 1216.
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2) K. Yonekura, S. Sakamori, K. Goto, M. Matsuura, N. Fujiwara and M. Yoneda: J. Vac. Sci. & Technol. B <B>22</B> (2004) 548.
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3) T. C. Chang, P. T. Liu, Y. J. Mei, Y. S. Mor, T. H. Perng, Y. L. Yang and S. M. Sze: J. Vac. Sci. & Technol. B <B>17</B> (1999) 2325.
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4) P. T. Liu, T. C. Chang, Y. S. Mor and S. M. Sze: Jpn. J. Appl. Phys. 38 (1999) 3482.
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5) Y. S. Kim, H. Nguyen, M. Dahimene, C. Bjorkman and H. Shan: Proc. Int. Symp. Dry Process, Tokyo, 2000, p. 245.
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