Art

J-GLOBAL ID：201002245037574746   Reference number：10A0605880

A new two-dimensional ultrasonic assisted grinding (2D-UAG) method and its fundamental performance in monocrystal silicon machining

単結晶シリコン加工での新二次元超音波援用研削(2D-UAG)方法とその基本的性能

Author (5)： LIANG Zhiqiang (Key laboratory of Fundamental Sci. for Advanced Machining, Beijing Inst. of Technol., Beijing 100081, CHN) ,  LIANG Zhiqiang (Dep. of Machine Intelligence and Systems Engineering, Akita Prefectural Univ., 84-4 Tsuchiya-ebinokuchi, Yurihonjo ...) ,  WU Yongbo (Dep. of Machine Intelligence and Systems Engineering, Akita Prefectural Univ., 84-4 Tsuchiya-ebinokuchi, Yurihonjo ...) ,  WANG Xibin (Key laboratory of Fundamental Sci. for Advanced Machining, Beijing Inst. of Technol., Beijing 100081, CHN) ,  ZHAO Wenxiang (Key laboratory of Fundamental Sci. for Advanced Machining, Beijing Inst. of Technol., Beijing 100081, CHN)
Material： International Journal of Machine Tools & Manufacture  (International Journal of Machine Tools & Manufacture Design, Research and Application)
Volume： 50  Issue： 8  Page： 728-736  Publication year： Aug. 2010 
JST Material Number： C0568A  ISSN： 0890-6955  Document type： Article
Article type： 原著論文  Country of issue： United Kingdom (GBR)  Language： ENGLISH (EN)

Thesaurus term： *grinding ,  ultrasonic application ,  *silicon ,  *single crystal ,  removal ,  diamond grinding wheel ,  piezoelectric material ,  surface roughness ,  piezoceramics ,  *monocrystal silicon ,  material removal

JST classification (1)： Manufacturing of glass  (YC02020O)

Terms in the title (5)： 単結晶シリコン ,  超音波 ,  援用 ,  研削 ,  2D