Art

J-GLOBAL ID：201302291798385835   Reference number：13A1793619

Photolithography for Minimal Fab System

小型ファブシステムのためのフォトリソグラフィー

Author (3)： KHUMPUANG Sommawan (Nanoelectronics Res. Inst., AIST) ,  MAEKAWA Hitoshi (Nanoelectronics Res. Inst., AIST) ,  HARA Shiro (Nanoelectronics Res. Inst., AIST)
Material： 電気学会論文誌 E  (IEEJ Transactions on Sensors and Micromachines)
Volume： 133  Issue： 9  Page： 272-277 (J-STAGE)  Publication year： 2013 
JST Material Number： L3098A  ISSN： 1341-8939  Document type： Article
Article type： 原著論文  Country of issue： Japan (JPN)  Language： ENGLISH (EN)

Thesaurus term： *photolithography ,  *micro circuit technique ,  *wafer ,  *semiconductor process ,  *circuit pattern generation ,  clean room ,  performance test
Semi thesaurus term： *semiconductor wafer

JST classification (1)： Manufacturing technology of solid-state devices  (NC03030V)

Reference (6)：

• CHANG, C. Y. Cleanroom Technology. ULSI Technology. 2000, 1
• HEA, Y. Z. Investigation into the flange problem of resist along the edge of substrate caused by spin coating. Microelectronic Engineering. 2002, 63, 347-352
• BRUIJINE, R. H. Experiments on finger formation during spin coating. 1999
• LEVINSON, H. J. Photoresists. Principles of Lithography. 2005, 62
• SCHWARTZ, L. W. On the shapes of droplets that are sliding on a vertical wall. Physica D. 2005, 209, 236-244

Terms in the title (2)： ファブ ,  フォトリソグラフィー