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J-GLOBAL ID:201501007752883441   Update date: Jun. 30, 2021

Kino Hisashi

キノ ヒサシ | Kino Hisashi
Affiliation and department:
Job title: Assistant Professor
Other affiliations (1):
Homepage URL  (1): http://www.lbc.mech.tohoku.ac.jp/index.html
Research field  (1): Electronic devices and equipment
Research theme for competitive and other funds  (12):
  • 2020 - 2023 不揮発性トンネルFETメモリによる超低消費電力ニューラルネットワークチップの開発
  • 2019 - 2023 Heterogeneous System Integration of Flexible Electronics Based on Multi-Scale Stress Engineering
  • 2019 - 2021 負の熱膨張ゲート電極によるトランジスタへの新規ひずみ導入技術の創成
  • 2018 - 2021 広視野の視覚を再建する眼球内完全埋植・低侵襲フレキシブル人工網膜の開発
  • 2019 - 2020 しきい値電圧自己調整機能を有するトンネルFETの開発
Show all
Papers (125):
  • Takafumi Fukushima, Mariappan Murugesan, Ji Cheol Bea, Hiroyuki Hashimoto, Hisashi Kino, Tetsu Tanaka, Mitsumasa Koyanagi. On-wafer thermomechanical characterization of a thin film polyimide formed by vapor deposition polymerization for through-silicon via applications: Comparison to plasma-enhanced chemical vapor deposition SiO2. Journal of Polymer Science. 2020. 58. 16. 2248-2258
  • Takafumi Fukushima, Yuki Susumago, Zhengyang Qian, Chidai Shima, Bang Du, Noriyuki Takahashi, Shuta Nagata, Tomo Odashima, Hisashi Kino, Tetsu Tanaka. Significant Die-Shift Reduction and μlED Integration Based on Die-First Fan-Out Wafer-Level Packaging for Flexible Hybrid Electronics. IEEE Transactions on Components, Packaging and Manufacturing Technology. 2020. 10. 8. 1419-1422
  • Kousei Kumahara, Rui Liang, Sungho Lee, Yuki Miwa, Mariappan Murugesan, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka. Low-temperature multichip-to-wafer 3D integration based on via-last TSV with OER-TEOS-CVD and microbump bonding without solder extrusion. Proceedings - Electronic Components and Technology Conference. 2020. 2020-June. 1199-1204
  • Noriyuki Takahashi, Yuki Susumago, Sungho Lee, Yuki Miwa, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima. RDL-first Flexible FOWLP Technology with Dielets Embedded in Hydrogel. Proceedings - Electronic Components and Technology Conference. 2020. 2020-June. 811-816
  • Yuki Miwa, Kousei Kumahara, Sungho Lee, Rui Liang, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka. 7-μm-thick NCF technology with low-height solder microbump bonding for 3D integration. Proceedings - Electronic Components and Technology Conference. 2020. 2020-June. 1453-1458
more...
MISC (2):
  • Morikawa Takumi, Harashima Takuya, Kino Hisashi, Fukushima Takafumi, Katayama Norihiro, Mushiake Hajime, Tanaka Tetsu. Development of Si opto neural probe with embedded optical fiber enabling layer-by-layer optical stimulation in the brain. Transactions of Japanese Society for Medical and Biological Engineering. 2017. 55. 3. 191-191
  • Harashima Takuya, Morikawa Takumi, Kino Hisashi, Fukushima Takafumi, Katayama Norihiro, Mushiake Hajime, Tanaka Tetsu. Development of Vertically-Stacked Multi-Shank Si Neural Probe Array with Sharpened Tip for 3-Dimensional Neural Recording. Transactions of Japanese Society for Medical and Biological Engineering. 2017. 55. 3. 189-189
Books (1):
  • 熱膨張制御材料の開発と応用
    シーエムシー出版 2018 ISBN:9784781313160
Lectures and oral presentations  (66):
  • Evaluation of bending stress in Au-wiring formed over FHE by micro-XRD
    (Solid State Devices and Materials 2020)
  • Evaluation of the Dopant Effects of ZnO-based Transparent Electrode on Electrochemical Characteristics for Biomedical Applications with Optical Devices
    (Solid State Devices and Materials 2020)
  • Development of Optical Waveguiding Neural Probe with Upconversion-Nanoparticle Light Emitter for Optogenetics
    (Solid State Devices and Materials 2020)
  • Fabrication and Evaluation of Neural Recording Microelectrode on Opto-Neural Probe with Upconversion Nanoparticles Light Emitter
    (Solid State Devices and Materials 2020)
  • Die-Level Cu-CMP Technology in Via-Last TSV Process for Multichip-to-Wafer 3D integration
    (Solid State Devices and Materials 2020)
more...
Professional career (1):
  • 博士(工学) (Tohoku University)
Awards (1):
  • 2018/03 - 一般財団法人 田中貴金属記念財団 2017年度「貴金属に関わる研究助成金」 シルバー賞 3D-NANDフラッシュメモリの大容量・低コスト・高信頼化に向けた超高密度Ptナノ粒子を有する電荷保持層の開発
Association Membership(s) (2):
IEEE ,  応用物理学会
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