Art

J-GLOBAL ID：201602273597739829   Reference number：16A1200620

Experimental determination of fatigue behavior of lead free solder joints in microelectronic packaging subjected to isothermal aging

等温エージングを受けたマイクロ電子パッケージングにおける鉛フリーはんだ接合の疲労挙動の実験的決定

Author (3)： Mustafa Muhannad (Center for Advanced Vehicle and Extreme Environment Electronics (CAVE3), Auburn University, Auburn, AL 36849, United States) ,  Suhling Jeffrey C. (Center for Advanced Vehicle and Extreme Environment Electronics (CAVE3), Auburn University, Auburn, AL 36849, United States) ,  Lall Pradeep (Center for Advanced Vehicle and Extreme Environment Electronics (CAVE3), Auburn University, Auburn, AL 36849, United States)
Material： Microelectronics Reliability  (Microelectronics and Reliability)
Volume： 56  Page： 136-147  Publication year： Jan. 2016 
JST Material Number： C0530A  ISSN： 0026-2714  Document type： Article
Article type： 原著論文  Country of issue： United Kingdom (GBR)  Language： ENGLISH (EN)

Thesaurus term： *aging (phenomenon) ,  *isothermal process ,  *IC package ,  solder ,  *soldering ,  *fatigue ,  *behavior ,  *experiment ,  shearing stress ,  *stress strain characteristic ,  tin base alloy ,  silver containing alloy ,  copper containing alloy ,  stress strain curve ,  model ,  fatigue life ,  safety standard ,  failure ,  *micro structure ,  structure analysis ,  finite element method ,  analytical model ,  shearing test ,  strain distribution ,  stress concentration ,  process ,  *isothermal aging ,  Pb free solder ,  *characteristic ,  curve ,  line
Semi thesaurus term： fatigue crack ,  SAC105 ,  empirical model ,  故障基準 ,  damage evolution

Author keywords (4)： Lead free soldering ,  Fatigue behavior ,  Aging ,  Microelectronic packaging

JST classification (2)： Measurement,testing and reliability of solid-state devices  (NC03040G) ,  Materials of solid-state devices  (NC03020K)

Terms in the title (7)： エージング ,  マイクロ ,  電子 ,  パッケージング ,  鉛フリーはんだ ,  疲労挙動 ,  実験