Art

J-GLOBAL ID：201702218508448136   Reference number：17A0317019

A fusion prognostics-based qualification test methodology for microelectronic products

マイクロエレクトロニクス製品のための融合予測ベース認定試験方法論【Powered by NICT】

Author (6)： Pecht Michael (IEEE, USA) ,  Pecht Michael (Center for Advanced Life Cycle Engineering, University of Maryland, College Park, MD 20742, USA) ,  Shibutani Tadahiro (National University, Yokohama 240-8501, Japan) ,  Kang Myeongsu (Center for Advanced Life Cycle Engineering, University of Maryland, College Park, MD 20742, USA) ,  Hodkiewicz Melinda (School of Mechanical and Chemical Engineering, University of Western Australia, Crawley, WA, Australia) ,  Cripps Edward (School of Mathematics and Statistics, University of Western Australia, Crawley, WA, Australia)
Material： Microelectronics Reliability  (Microelectronics and Reliability)
Volume： 63  Page： 320-324  Publication year： 2016 
JST Material Number： C0530A  ISSN： 0026-2714  Document type： Article
Article type： 原著論文  Country of issue： United Kingdom (GBR)  Language： ENGLISH (EN)

Abstract/Point： The global market for microele...

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Thesaurus term： producer ,  centralization ,  reliability (property) ,  engineer ,  *microelectronics ,  data driven ,  failure physics ,  global market ,  *qualification test

Author keywords (5)： Microelectronics ,  Physics-of-failure ,  Prognostics ,  Qualification testing ,  Reliability

JST classification (1)： Measurement,testing and reliability of solid-state devices  (NC03040G)

Terms in the title (5)： マイクロエレクトロニクス ,  融合 ,  予測 ,  認定試験 ,  方法論