Art

J-GLOBAL ID：201702220535261283   Reference number：17A1110680

Warp Measurement for Large-Diameter Silicon Wafer Using Four-Point-Support Inverting Method

4点支持反転法を使用した大口径シリコンウエハに対する反り測定

Author (2)： ITO Yukihiro (Tokyo Metropolitan Coll. Industrial Technol., Tokyo, JPN) ,  KUNIEDA Masanori (Univ. Tokyo, Tokyo, JPN)
Material： International Journal of Automation Technology  (Int J Autom Technol)
Volume： 11  Issue： 5  Page： 721-727  Publication year： Sep. 05, 2017 
JST Material Number： L0997B  ISSN： 1881-7629  Document type： Article
Article type： 原著論文  Country of issue： Japan (JPN)  Language： ENGLISH (EN)

Thesaurus term： reversal ,  supporting structure ,  *large diameter ,  *wafer ,  *warpage ,  *measurement ,  accuracy ,  gravity ,  deflection (direction) ,  shape measurement ,  air bearing ,  reproducibility ,  superiority ,  *Si wafer ,  high accuracy ,  surface metrology
Semi thesaurus term： support ,  *measurement ,  surface metrology ,  superiority

JST classification (1)： General  (NC03161C)

Reference (11)：

• “Standard Test Method for Measuring Warp and Total Thickness Variation on Silicon Wafers by Noncontact Scanning,” ASTM, F657-92, pp. 196-205, 1999.
• N. Maruya et al., “Recent Technology of flatness Measurement in Large Area, J. of Japan Society for Design Engineering,” Vol.37, No.10, pp. 18-22, 2002.
• M. Jansen et al., “Development of a double slide stitching interferometer for wafer characterization, Annals of the CIRP,” Vol.55, No.1, pp. 555-558, 2006.
• H. Liu et al., “Three-point-support method based on position determination of supports and wafers to eliminate gravity-induced deflection of wafers,” Precision Engineering, Vol.46, pp. 339-348, 2016.
• Y. Ito et al., “Simultaneous Measurement of Warp and Thickness of Silicon Wafer Using Three-Point-Support Inverting Method,” J. of the Japan Society for Precision Engineering, Vol.76, No.11, pp. 1305-1309, 2010 (in Japanese).

Terms in the title (5)： 支持 ,  反転 ,  大口径 ,  シリコンウエハ ,  反り