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J-GLOBAL ID：201702221859212810   Reference number：17A1036941

A study on low temperature SAM modified POM direct bonding affected by VUV/O₃ irradiation

VUV/O_3照射の影響を受けた低温度SAMで修飾したPOM直接ボンディングに関する研究【Powered by NICT】

Author (5)： Fu Weixin (Faculty of Science and Engineering, Waseda University, Tokyo, Japan) ,  Ma Bo (Faculty of Science and Engineering, Waseda University, Tokyo, Japan) ,  Kuwae Hiroyuki (Faculty of Science and Engineering, Waseda University, Tokyo, Japan) ,  Shoji Shuichi (Faculty of Science and Engineering, Waseda University, Tokyo, Japan) ,  Mizuno Jun (Research Organization for Nano and Life Innovation, Waseda University, Tokyo, Japan)
Material： IEEE Conference Proceedings  (IEEE Conf Proc)
Volume： 2017  Issue： LTB-3D  Page： 69  Publication year： 2017 
JST Material Number： W2441A  Document type： Proceedings
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)

Abstract/Point： A direct bonding of polyoxymet...

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Thesaurus term： bond strength ,  medical equipment ,  *low temperature ,  surface modification ,  MEMS ,  self-assembled monolayer
Semi thesaurus term： 機械システム , 【Automatic Indexing@JST】

JST classification (2)： Carbon and its compounds  (YB02060D) ,  Organosilicon compounds  (CF08030C)

Terms in the title (7)： VUV ,  低温度 ,  SAM ,  修飾 ,  POM ,  ボンディング ,  研究