Art

J-GLOBAL ID：201802222205293619   Reference number：18A0556964

Change in Electrical Resistivity of Pure Cu Processed by Accumulative Roll Bonding

蓄積ロールボンディングした純銅の電気抵抗変化

Author (6)： Miyajima Yoji (Department of Materials Science and Engineering, Interdisciplinary Graduate School of Science and Engineering, Tokyo Institute of Technology) ,  Shinohara Takahiko (Department of Materials Science and Engineering, Interdisciplinary Graduate School of Science and Engineering, Tokyo Institute of Technology) ,  Adachi Hiroki (Department of Materials Science and Chemistry, Graduate School of Engineering and University of Hyogo) ,  Fujii Toshiyuki (Department of Innovative and Engineered Materials, Interdisciplinary Graduate School of Science and Engineering, Tokyo Institute of Technology) ,  Onaka Susumu (Department of Materials Science and Engineering, Interdisciplinary Graduate School of Science and Engineering, Tokyo Institute of Technology) ,  Kato Masaharu (Department of Materials Science and Engineering, Interdisciplinary Graduate School of Science and Engineering, Tokyo Institute of Technology)
Material： Materials Transactions  (Mater Trans)
Volume： 59  Issue： 3  Page： 393-398(J-STAGE)  Publication year： 2018 
JST Material Number： G0668A  ISSN： 1345-9678  Document type： Article
Article type： 原著論文  Country of issue： Japan (JPN)  Language： ENGLISH (EN)

Thesaurus term： backward scattering ,  *pressure welding ,  *sandwich rolling ,  *Copper ,  *electric resistance ,  variation ,  *density ,  *grain boundary ,  X-Ray Diffraction ,  *dislocation density ,  grain refinement ,  electron backscattering ,  *severe plastic deformation ,  *accumulative roll-bonding ,  modification
Semi thesaurus term： *severe plastic deformation ,  *accumulative roll-bonding ,  resistance change ,  *粒界密度

Author keywords (6)： electrical resistivity ,  microstructure ,  dislocation density ,  lattice defects ,  ultrafine grains ,  copper

JST classification (2)： Electrical properties  (WB02010Y) ,  Rolling techniques  (WC06030Z)

Reference (15)：

• 1) A. Azushima, R. Kopp, A. Korhonen, D.Y. Yang, F. Micari, G.D. Lahoti, P. Groche, J. Yanagimoto, N. Tsuji, A. Rosochowski and A. Yanagida: CIRP Annu.-Manuf. Technol. 57 (2008) 716-735. 10.1016/j.cirp.2008.09.005
• 2) E.H. Sondheimer: Adv. Phys. 1 (1952) 1-42. 10.1080/00018735200101151
• 3) A.F. Mayadas and M. Shatzkes: Phys. Rev. B 1 (1970) 1382-1389. 10.1103/PhysRevB.1.1382
• 4) Y. Miyajima, S.Y. Komatsu, M. Mitsuhara, S. Hata, H. Nakashima and N. Tsuji: Philos. Mag. 90 (2010) 4475-4488. 10.1080/14786435.2010.510453
• 5) Y. Miyajima, S. Komatsu, M. Mitsuhara, S. Hata, H. Nakashima and N. Tsuji: Philos. Mag. 95 (2015) 1139-1149. 10.1080/14786435.2015.1021400

Terms in the title (3)： 蓄積ロールボンディング ,  純銅 ,  電気抵抗