About Al Farisi Muhammad Salman
About Department of Robotics, Graduate School of Engineering, Tohoku University, Sendai 980-8579, Japan
About Hirano Hideki
About Micro System Integration Center (μSIC), Tohoku University, Sendai 980-8579, Japan
About Tanaka Shuji
About Department of Robotics, Graduate School of Engineering, Tohoku University, Sendai 980-8579, Japan
About Tanaka Shuji
About Micro System Integration Center (μSIC), Tohoku University, Sendai 980-8579, Japan
About Sensors and Actuators. A. Physical
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About reliability(property)
About pressure measurement
About MEMS
About diamond
About bonding and joining
About shear strength
About low temperature
About electric contact
About cutting(machining)
About optimization
About ミクロ構造
About 機能性
About 機械システム
About 平坦化
About フライカット
About Heterogeneous integration
About Wafer-level hermetic packaging
About Cu-Cu thermo-compression bonding
About Single-point diamond fly-cutting
About Measuring methods and instruments of force,work load,pressure,friction
About Manufacturing technology of solid-state devices
About Materials of solid-state devices
About ウエハレベル
About MEMS
About パッケージング
About フライカット
About 平坦化
About 電気めっき
About 銅
About 封止
About 低温
About 熱圧縮