Art
J-GLOBAL ID:201802283576644983   Reference number:18A1903933

Skin Effect Suppressed Ni-Fe/Cu Electroplated Multilayer Wiring for High Data-Rate and Low Delay-Time I/O Interface Board

高データレートおよび低遅延時間I/Oインタフェイスボードのための表皮効果抑制Ni-Fe/Cu電気めっき多層配線【JST・京大機械翻訳】
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Volume: 54  Issue: 11  Page: ROMBUNNO.4002705.1-5  Publication year: 2018 
JST Material Number: A0339B  ISSN: 0018-9464  CODEN: IEMGAQ  Document type: Article
Article type: 原著論文  Country of issue: United States (USA)  Language: ENGLISH (EN)
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Application of negative permea...
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