Art
J-GLOBAL ID:201902261686633567   Reference number:19A0898877

Reliability Evaluation of SiC Power Module With Sintered Ag Die Attach and Stress-Relaxation Structure

焼結Agダイアタッチと応力緩和構造を持つSiCパワーモジュールの信頼性評価【JST・京大機械翻訳】
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Material:
Volume:Issue:Page: 609-615  Publication year: 2019 
JST Material Number: W0590B  ISSN: 2156-3950  CODEN: ITCPC8  Document type: Article
Article type: 原著論文  Country of issue: United States (USA)  Language: ENGLISH (EN)
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Silicon carbide (SiC) power mo...
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Hydrid integrated circuit  ,  Semiconductor lasers  ,  Manufacturing technology of solid-state devices  ,  Light emitting devices  ,  Heating 

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