Art

J-GLOBAL ID：202002242972051117   Reference number：20A0546803

Strengthening of DBA substrate with Ni/Ti/Ag metallization for thermal fatigue-resistant Ag sinter joining in GaN power modules

GaNパワーモジュールにおける熱疲労抵抗Ag焼結接合のためのNi/Ti/AgメタライゼーションによるDBA基板の強化【JST・京大機械翻訳】

Author (6)： Kim Dongjin (Department of Adaptive Machine Systems, Graduate School of Engineering, Osaka University, Suita-shi, Osaka, Japan) ,  Kim Dongjin (The Institute of Scientific and Industrial Research, Osaka University, Ibaraki-shi, Osaka, Japan) ,  Chen Chuantong (The Institute of Scientific and Industrial Research, Osaka University, Ibaraki-shi, Osaka, Japan) ,  Lee Seung-Joon (Department of Advanced Materials Engineering, Korea Polytechnic University, Siheung, Republic of Korea) ,  Nagao Shijo (The Institute of Scientific and Industrial Research, Osaka University, Ibaraki-shi, Osaka, Japan) ,  Suganuma Katsuaki (The Institute of Scientific and Industrial Research, Osaka University, Ibaraki-shi, Osaka, Japan)
Material： Journal of Materials Science. Materials in Electronics  (J Mater Sci Mater Electron)
Volume： 31  Issue： 4  Page： 3715-3726  Publication year： 2020 
JST Material Number： W0003A  ISSN： 0957-4522  CODEN： JMTSAS  Document type： Article
Article type： 原著論文  Country of issue： Germany, Federal Republic of (DEU)  Language： ENGLISH (EN)

Abstract/Point： Abstract: This study was carri...

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Thesaurus term： shear strength ,  adhesion(surface chemistry) ,  thermal shock ,  rigidity ,  plastic deformation ,  aluminum ,  simulation ,  *nickel ,  interface(surface) ,  *silver ,  stress relaxation ,  recrystallization ,  *sintering ,  *metallization(IC) ,  high temperature

JST classification (1)： Manufacturing technology of solid-state devices  (NC03030V)

Terms in the title (10)： GaN ,  パワーモジュール ,  熱疲労 ,  Ag ,  焼結接合 ,  Ni ,  Ti ,  メタライゼーション ,  DBA ,  強化