Pat
J-GLOBAL ID:202003002164430215
樹脂粉末、立体造形用樹脂粉末、立体造形物、立体造形物の製造方法、及び立体造形物の製造装置
Inventor:
,
Applicant, Patent owner:
Agent (1):
廣田 浩一
Gazette classification:公開公報
Application number (International application number):2020066817
Publication number (International publication number):2020189965
Application date: Apr. 02, 2020
Publication date: Nov. 26, 2020
Summary:
【課題】高寸法安定性と高表面平滑性を有し、高密度で高品質な造形物を造形可能である樹脂粉末の提供。【解決手段】樹脂粒子と、個数一次粒子径が1.50μm以下の樹脂微粒子とを含む樹脂粉末である。【選択図】なし
Claim (excerpt):
樹脂粒子と、個数一次粒子径が1.50μm以下の樹脂微粒子とを含む樹脂粉末。
IPC (8):
C08J 3/12
, B33Y 30/00
, B33Y 10/00
, B33Y 70/00
, C08L 101/00
, C08L 23/12
, C08L 61/28
, C08L 33/04
FI (8):
C08J3/12 A
, B33Y30/00
, B33Y10/00
, B33Y70/00
, C08L101/00
, C08L23/12
, C08L61/28
, C08L33/04
F-Term (22):
4F070AA15
, 4F070AA47
, 4F070AB11
, 4F070AC23
, 4F070AC43
, 4F070AC83
, 4F070AC85
, 4F070AE05
, 4F070AE06
, 4F070DA41
, 4F070DC07
, 4F070DC11
, 4J002AA011
, 4J002BB121
, 4J002BG042
, 4J002BG052
, 4J002CC182
, 4J002CF071
, 4J002DJ017
, 4J002EH056
, 4J002EY016
, 4J002FD106
Patent cited by the Patent:
Cited by examiner (6)
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