Rchr
J-GLOBAL ID：200901082466778154
Update date: Sep. 02, 2022
Kuroki Yukinori
クロキ ユキノリ | Kuroki Yukinori
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Affiliation and department：
Kyushu University Faculty of Information Science and Electrical Engineering
About Kyushu University Faculty of Information Science and Electrical Engineering
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Job title：
Professor
Homepage URL (1)：
http://me.ed.kyushu-u.ac.jp/~micro/index.html
Research field (2)：
Electronic devices and equipment
, Thin-film surfaces and interfaces
Research keywords (2)：
電子デバイス工学
, Electronic Device Engineering
Research theme for competitive and other funds (5)：
2007 - 2008 通信用アナログLSI回路の研究
2005 - 2007 3次元実装技術の開発研究
集積回路プラズマプロセスに関する研究
Application of CAD for Microelectronic Device and Process
Study on Plasma Processing for LSI
MISC (20)：
Akihiro Ikeda, Atsushi Sakamoto, Reiji Hattori, Yukinori Kuroki. Electroless Ni-B plating on SiO2 with 3-aminopropyl-triethoxysilane as a barrier layer against Cu diffusion for through-Si via interconnections in a 3-dimensional multi-chip package. THIN SOLID FILMS. 2009. 517. 5. 1740-1745
Li Tianmao, Kuroki Yukinori. Design of a differential delay circuit with 100ps resolution. Research reports on information science and electrical engineering of Kyushu University. 2008. 13. 1. 13-17
Li Tianmao, Tashiro Hiroyuki, Uchihata Haruki, Kuroki Yukinori. A high precision current source circuit by means of switched-capacitor and PLL for BOST. Research reports on information science and electrical engineering of Kyushu University. 2008. 13. 1. 19-23
A. Ikeda, K. Kajiwara, Y. Kimiya, Y. Fukunaga, Y. Kuroki. Effects of plasma cleaning conditions on the characteristics of MOSFETs for electroless Ni plating on Al pads. Proceddings of 30th International Symposium on Dry Process. 2008. 101-102
Akihiro Ikeda, Tsubasa Saeki, Atsushi Sakamoto, Yosuke Sugimoto, Yasuhiro Kimiya, Yoshiaki Fukunaga, Reiji Hattori, Hisao Kuriyaki, Yukinori Kuroki. Uniformity of an electroless plated Ni on a pad connected to different size pads or a Pn junction for under bump metallurgy in a flip-chip assembly. IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES. 2007. 30. 3. 494-499
ｍore...
Books (1)：
学びやすい集積回路工学
昭晃堂 2005 ISBN:4785612169
Works (2)：
チップレベル積層のためのアライメント装置の開発
2002 -
Development of Assembler for Chip-level Stacking of LSI
2002 -
Education (4)：
- 1970 Kyushu University
- 1970 Kyushu University Graduate School, Division of Engineering
- 1968 Kyushu University School of Engineering
- 1968 Kyushu University Faculty of Engineering
Professional career (2)：
(BLANK)
(BLANK)
Work history (2)：
1970 - 1991 日本電気研究所
1970 - 1991 Scientist, Microelectronics Lab., NEC
Committee career (2)：
2000 - 2002 日本応用物理学会 九州支部理事,本部理事,支部長
2002 - 電子情報通信学会 LSI動作解析技術研究会委員
Awards (1)：
1992 - IEEE ICMTS-91 Best Paper Award
Association Membership(s) (4)：
IEEE
, 電気学会
, 電子情報通信学会
, 日本応用物理学会
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