- 2023/01 - IEEE Solid-State Circuits Society (SSCS) Distinguished Lecturer (DL) Terms 2021-2022
- 2019/08 - Kobe University, "Kobe University Excellent Young Researcher Award, President Award," (Cyber-Physical Interactive Technology for Society5.0)
- 2019/03 - Marubun Research Promotion Foundation, "Marubun Research Promotion Award," (LSI System Application of Near-Field EM Field Interaction Between Interconncetions and Circuits)
- 2017/06 - IEICE, "Suematsu Yasuharu Award," (IC Performance Enhancement by Near-Field Inductive-Coupling Coils)
- 2014/09 - IACR CHES 2014, "Best Paper Award," (EM Attack is Non- Invasive? - Design Methodology and Validity Verification of EM Attack Sensor)
- 2013/02 - IEEE ISSCC, "Top ISSCC Paper Contributors 2004-2013," (More than 10 Papers Publication at ISSCC 2004-2013)
- 2007/03 - Keio University, "Excellent Reserach Award," (Graduation with Top Honor, Dept. of Integrated Design Engineering, Graduate School of Science and Technology, Keio University in 2006)
- 2007/01 - ASP-DAC 2007 University Design Contest Committee Outstanding Design Award "A 1Tb/s 3W Inductive-Coupling Transceiver Chip,"
- 2006/12 - IP Based SoC Design Conference, "Best Design Award," (1Tb/s 3W Inductive-Coupling Transceiver IP for 3D-Stacked SiP)
- 2006/09 - IEEE Solid-State Circuits Society Japan Chapter, "IEEE Young Research Promotion Award," (Keio Kuroda Lab. VDEC Test Chip Design Review: 3D-Stacked Inter-Chip Inductive-Coupling Transceiver)
- 2006/07 - International Ph.D. Student Workshop on SoC, "Excellent Paper Award," (A 1Tb/s 3W Inductive-Coupling Transceiver for 3D ICs)
- 2006/05 - 2006 IP Award Organizing Committee, "Excellent IP Award," (1Tb/s 3W 3D-Stacked Inductive-Coupling Interface)
- 2005/11 - IEEE Solid-State Circuits Society Japan Chapter, "IEEE System LSI Award," (195Gb/s 1.2W 3D-Stacked Inductive-Coupling Interface)
- 2003/03 - Keio University, "Keio Kougakukai Award," (Top Honor Graduation, Dept. of EE, Keio University in 2002)