Rchr
J-GLOBAL ID：202001008059641708   Update date: Feb. 01, 2024

Miyama Katsumi

ミヤマ カツミ | Miyama Katsumi
Affiliation and department：
北海道科学大学 工学部 機械工学科

About 北海道科学大学 工学部 機械工学科


Job title： 教授
Homepage URL  (1)： https://labs.hus.ac.jp/details.php?id=131/
Research field  (2)： Electronic devices and equipment ,  Material fabrication and microstructure control
Research keywords  (4)： Surface Tratment ,  Printed Wiring Board ,  Non-destructive inspectioon ,  Joining, Welding
Research theme for competitive and other funds  (1)：
  • 2021 - 2024 ナノインプリント法を用いた超微細配線の創製
Papers (22)：
  • 吉田 協, 見山 克己. 形削り盤を利用したやすり加工性能試験装置の開発-Development of the file performance tester based on the shaper. Abrasive technology : 砥粒加工学会誌 : journal of the Japan Society for Abrasive Technology. 2023. 67. 3. 143-149
  • EIJI TOMA, Katsumi Miyama. Optimization of Bonding and Sizing Process for Automotive Wet Clutch Discs applying "Robust Design". Journal of the Institute of Industrial Applications Engineers. 2020. 8. 2. 73-83
  • MIYAMA Katsumi, YOSHIDA Kanou, OKUMURA Mitsunori, SAKURABA Yohei, TANAKA Hiroyuki, AIYAMA Hideaki. Fabrication of Artificial Delamination Flaw Specimens and an Application of Active Thermography. Journal of The Japanese Society for Non-Destructive Inspection. 2020. 69. 7. 333-339
  • Toma Eiji, Miyama Katsumi, Iuchi Satoshi. Optimization of Flight Stability of Water Rockets by Integrated Analysis of "Dynamic Simulation System" and "Robust Design". The Japanese Journal of the Institute of Industrial Applications Engineers. 2020. 8. 1. 28-38
  • MATSUDA Hisashi, HIRAMOTO Riho, MIYAMA Katsumi, TAKEZAWA Satoshi. Planning and Practice of a New Group Working Program for Freshmen of Mechanical Engineering Department. Journal of JSEE. 2019. 67. 3. 3_33-3_37
ｍore...
MISC (36)：
  • 鈴木 逸人, 戸羽 篤也, 見山 克己. 金属積層造形により製作した立体配管への循環めっき処理方法-Circulation Plating Method for the Piping Manufactured by Metal-powder Bed Fusion-特集 最近の製造技術の開発と応用. 化學工業. 2022. 73. 2. 95-103
  • Joining Interface of Plating and Solder. 2021. 72. 10. 530-536
  • 植竹亮太, 吉田協, 見山克己. Friction Spot Welding of Hot-dip Galvanized Steel and Aluminum Alloy Sheet. Symposium on Microjoining and Assembly Technology in Electronics. 2021. 27th
  • Evaluation of Degradation of Mechanical Properties of Polypropylene for Ankle Foot Orthoses by Thermal Cycle Test. 2020. 48. 51-54
  • Influence of Construction Temperature of Stud Welding. 2020. 48. 39-42
ｍore...
Lectures and oral presentations  (16)：
  • 1B06 Planning and Practice of a New Group Working Program for Fresh-men of Mechanical Engineering Department
    (Proceedings of Annual Conference of Japanese Society for Engineering Education 2019)
  • 2E01 Study on Tool Wear of File at Machine Shop Practice (3<sup>rd</sup> Report):Single Cut File used for Cutting Cycle Test of S25C
    (Proceedings of Annual Conference of Japanese Society for Engineering Education 2018)
  • Effect of substrate construction on stress/strain distribution and deformation of the device-embedded substrates
    (Proceedings of JIEP Annual Meeting 2018)
  • Non-destructive Inspection of Material Flaws with Active Thermography
    (The Proceedings of Conference of Hokkaido Branch 2018)
  • Relationship between Cutting Force and the Workpiece Hardness of the File
    (The Proceedings of Conference of Hokkaido Branch 2018)
ｍore...
Education (1)：
  • - 1987 Hokkaido University School of Engineering
Professional career (1)：
  • 博士(工学) (北海道工業大学)
Work history (6)：
  • 2014/04 - 現在 Hokkaido University of Science
  • 2013/04 - 2014/03 Hokkaido Institute of Technology The Faculty of Advanced Engineering Department of Mechanical Systems Engineering
  • 2010/04 - 2013/03 Hokkaido Institute of Technology The Faculty of Advanced Engineering Department of Mechanical Systems Engineering
  • 1998/12 - 2010/03 Clover Electronics Co., Ltd
  • 1995/07 - 1998/11 札幌高級鋳物株式会社
Show all
Committee career (3)：
  • 2020/01 - 現在 エレクトロニクス実装学会 北海道・東北支部長
  • 2019/01 - 2020/12 表面技術協会 北海道支部長
  • 2018/01 - 2019/12 腐食防蝕学会 北海道支部長
Awards (3)：
  • 2018/04 - The Japan Institute of Electronics Packaging Outstanding Technical Paper Awards of ICEP 2017, Effects of External Bending Stress on Device-Embedded Substrate
  • 2018/03 - 一般社団法人溶接学会 溶接技術奨励賞
  • 2017/03 - 一般社団法人エレクトロニクス実装学会 第30回エレクトロニクス実装学会春季講演大会優秀賞
Association Membership(s) (10)：
日本工学教育協会 ,  日本軽金属学会 ,  日本技術士会 ,  日本非破壊検査協会 ,  溶接学会 ,  腐食防蝕学会 ,  表面技術協会 ,  エレクトロニクス実装学会 ,  日本機械学会 ,  日本金属学会
※ Researcher’s information displayed in J-GLOBAL is based on the information registered in researchmap. For details, see here.

Return to Previous Page

TOP

BOTTOM