Rchr
J-GLOBAL ID：202101011495564458
Update date: Feb. 24, 2024
INOUE Fumihiro
イノウエ フミヒロ | INOUE Fumihiro
Affiliation and department：
Homepage URL (2)：
https://inoue.ynu.ac.jp/
,
https://inoue.ynu.ac.jp/en/
Research field (3)：
Composite materials and interfaces
, Electronic devices and equipment
, Nano/micro-systems
Research keywords (5)：
Hybrid Bonding
, Wafer Bonding
, Chemical Mechanical Polishing
, Chiplet
, 3D Integration
Research theme for competitive and other funds (3)：
- 2023 - 2026 原子層堆積ハイブリッド表面の局所ダイナミクスの解明と3Dヘテロデバイスへの応用
- 2022 - 2025 3Dチップレット型ヘテロ量子デバイスの創生
- 2021 - 2023 ボトムアップ型選択成長技術のハイブリッド接合への応用
Papers (58)：
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F. Nagano, F. Inoue, A. Phommahaxay, L. Peng, F. Chancerel, H. Naser, G. Beyer, A. Uedono, E. Beyne, S. De. Gendt, et al. Origin of Voids at the SiO2/SiO2 and SiCN/SiCN Bonding Interface Using Positron Annihilation Spectroscopy and Electron Spin Resonance. ECS Journal of Solid State Science and Technology. 2023. 12. 3
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Junya Fuse, Tomoya Iwata, Sodai Ebiko, Fumihiro Inoue. Robust Measurement of Bonding Strength for Wafer-to-Wafer 3D Integration. 2023 International Conference on Electronics Packaging, ICEP 2023. 2023. 105-106
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Kohei Nakayama, Tomoya Iwata, Sodai Ebiko, La Thi Ngoc Mai, Ken Harada, Masahiro Yokoyama, Yasuhiro Kawase, Fumihiro Inoue. Surface Topography Control on Cu Pad for Hybrid Bonding. 2023 IEEE International Interconnect Technology Conference and IEEE Materials for Advanced Metallization Conference, IITC/MAM 2023 - Proceedings. 2023
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Fumihiro Inoue, Shunsuke Teranishi, Tomoya Iwata, Koki Onishi, Naoko Yamamoto, Akihito Kawai, Shimpei Aoki, Takashi Hare, Akira Uedono. Inorganic Temporary Direct Bonding for Collective Die to Wafer Hybrid Bonding. Proceedings - Electronic Components and Technology Conference. 2023. 2023-May. 556-563
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F. Nagano, S. Iacovo, A. Phommahaxay, F. Inoue, F. Chancerel, H. Naser, G. Beyer, E. Beyne, S. De. Gendt. Void Formation Mechanism Related to Particles during Wafer-to-Wafer Direct Bonding. ECS Journal of Solid State Science and Technology. 2022. 11. 6
ｍore...
MISC (1)：
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Inoue Fumihiro. Wafer Thinning for 3D Integration. Journal of The Japan Institute of Electronics Packaging. 2023. 26. 1. 172-177
Work history (2)：
- 2011/03 - 2021/03 imec
- 2013/03 - 2014/10 Tohoku University
Committee career (3)：
- 2021/10 - ADMETA Committee Member
- 2021/05 - ICEP Technical Program Committee Member
- 2021/05 - IITC Committee Member
Awards (3)：
- 2022/06 - IEEE Electronics Packaging Society Outstanding Young Engineer Award
- 2022/05 - 2021 International Conference on Electronics Packaging Outstanding Technical Paper Award
- 2017/05 - 5th International Workshop on Low Temperature Bonding for 3D Integration Best presentation award
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