Rchr
J-GLOBAL ID:202101021471898415
Update date: Oct. 17, 2024
Hashizume Masaki
Hashizume Masaki
Affiliation and department:
Job title:
Director/ Specially Appointed Professor
Research field (2):
Electronic devices and equipment
, Computer systems
Research theme for competitive and other funds (8):
- 2023 - 2026 Design for Testability for Electrical Tests of Interconnects between Dies after Shipment
- 2017 - 2021 Open Defect Detection at Interconnects among IC Chips with Relaxation Oscilators
- 2015 - 2017 IC Test Method Based on Charge Volume Injected from a Power Supply Circuit within a Timing Window
- 2012 - 2014 Dynamic Supply Current Test Method with Built-in IDDT Appearance Time Sensor
- 2010 - 2011 Supply Current Testable Design of DACs in SoCs
- 2006 - 2008 Current Testing for Opens and Shorts in SoCs and SiPs
- 2003 - 2005 Electrical Testing of Open Defects in Deep Sub-micron CMOS Logic Circuits
- 2001 - 2002 Open Defect Detection Method Based on Supply Current in CMOS Logic Circuits
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Papers (136):
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Daichi Akamatsu, Hiroyuki Yotsuyanagi, Masaki Hashizume. Design of an Efficient PRPG for Testing an Approximate Multiplier Using Truncation. Proc. of 2024 International Technical Conference on Circuits/Systems, Computers and Communications (ITC-CSCC). 2024
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Yamahashi Yuya, Ohmatsu Masao, Hiroyuki Yotsuyanagi, Shyue-Kung Lu, Masaki Hashizume. Dependence of Threshold Values for Interconnect Testing with Relaxation Oscillators on Unit-to-unit Variations of ICs. Proc. of 2024 International Technical Conference on Circuits/Systems, Computers and Communications (ITC-CSCC). 2024
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Hiroyuki Yotsuyanagi, Masaki Hashizume. Testing of Weak Open Defects in Interconnects Using Boundary Scan. Journal of The Japan Institute of Electronics Packaging. 2024. 27. 4. 288-293
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Yuki Ikiri, Hiroyuki Yotsuyanagi, Fara Ashikin Binti Ali, Shyue-Kung Lu, Masaki Hashizume. A DfT Technique for Electrical Interconnect Testing of Circuit Boards with 3D Stacked SRAM ICs. Proc. of 12th IEEE CPMT Symposium Japan (ICSJ2023). 2023. 113-116
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Shogo Tokai, Daichi Akamatsu, Hiroyuki Yotsuyanagi, Masaki Hashizume. On Test Pattern Generation Method for an Approximate Multiplier Considering Acceptable Faults. Proceedings - 7th IEEE International Test Conference in Asia, ITC-Asia 2023. 2023
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MISC (106):
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吉村俊哉, 四柳浩之, 橋爪正樹. An FPGA Implementation of Design for Testability Circuit for Detecting Resistive Interconnect Opens. エレクトロニクス実装学会講演大会講演論文集(CD-ROM). 2024. 38th
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有元康滋, 四柳浩之, 橋爪正樹. A Study on Boundary Scan Design for Testing Interconnects between ICs in a Stand-by Mode. エレクトロニクス実装学会講演大会講演論文集(CD-ROM). 2023. 37th
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大松正男, 大寺佑都, 四柳浩之, 橋爪正樹, LU S-K. Detectability of Resistive Open Defects in Interconnect Tests with Analog Relaxation Oscillators. マイクロエレクトロニクスシンポジウム論文集. 2023. 33rd
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赤松大地, 東海翔午, 四柳浩之, 橋爪正樹. On Reducing Area Overhead of BIST for Approximate Multiplier Considering Truncated Bits. 電子情報通信学会技術研究報告(Web). 2023. 123. 258(VLD2023 30-79)
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有元康滋, 四柳浩之, 奥本裕也, 宮谷康希, 橋爪正樹. On the Evaluation of Boundary Scan Design for Testing Interconnects between ICs in a Stand-by Mode. 電気・電子・情報関係学会四国支部連合大会講演論文集(CD-ROM). 2023. 2023
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Books (4):
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Three-Dimensional Integration of Semiconductors --- Processing, Materials, and Applications --- Trends in 3D Integrated Circuit (3D-IC) Testing Technology
Springer 2015
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LSIテスティングハンドブック
Ohmsha, Ltd. 2008
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パソコンによるLisp入門-増補版-
森北出版 1986
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パソコンによるLisp入門
森北出版 1985
Education (3):
- 1993 - Kyoto University
- 1981 - Graduated from the Graduate School of Engineering, Tokushima University.
- 1979 - Graduated from the Faculty of ---, --- University.
Professional career (1):
- Doctor of Engineering (Kyoto University)
Work history (14):
- 2023/04 - 現在 The Open University of Japan Tokushima Study Center Director/ Specially Appointed Professor
- 2020/04 - 2022/03 The University of Tokushima Graduate School of Technology, Industrial and Scocial Sciences Dean
- 2020/04 - 2022/03 The University of Tokushima Graduate School of Science and Technology for Innovation Dean
- 2017/09 - 2020/03 The University of Tokushima Graduate School of Advanced Technology and Science Dean
- 2017/09 - 2020/03 The University of Tokushima Faculty of Science and Technology Dean
- 2016/04 - The University of Tokushima Faculty of Sience and Technology Professor
- 2005/03 - 2016/03 徳島大学教授,工学部電気電子工学科
- 1997/01 - 徳島大学助教授,工学部電気電子工学科
- 1996/03 - オランダ王国デルフト工業大学客員研究員(6ヶ月)
- 1992/11 - 徳島大学講師,工学部電気電子工学科
- 1990/01 - 徳島大学助手,工学部電気電子工学科
- 1987/05 - 京都大学工学部情報処理関係内地研究員(9ヶ月)
- 1983/04 - 徳島大学助手,工業短期大学部電子工学科
- 1981/04 - 日本電信電話公社武蔵野電気通信研究所研究員
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Awards (16):
- 2024/06 - 日本電子回路工業会(JPCA) アカデミックプラザ賞 待機状態IC の入力配線検査を行う バウンダリスキャン用コントローラの試作
- 2019/11/14 - IEEE 2018 JETTA/TTTC Best Paper Award Address Remapping Techniques for Enhancing Fabrication Yield of EmbeddedMemories
- 2019/06/21 - International Technical Conference on Circuits/Systems, Computers and Communications (ITC-CSCC) Best Paper Award On Design and Evaluation of a TDC Cell Embedded in the Boundary Scan Circuit for Delay Fault Testing of 3D ICs
- 2019/02/18 - IEEE CASS Shikoku Chapter IEEE CASS Shikoku Chapter Best Paper Award Address Scrambling and Data Inversion Techniques for Yield Enhancement of NROM-Based ROMS
- 2018/12/06 - 電子情報通信学会 ディペンダブルコンピューティング研究専門委員会 第5回研究会若手優秀講演賞 TDC組込み型バウンダリスキャンにおける遅延付加部のリオーダによる配線長の低減
- 2018/10/16 - The 26th IEEE Asian Test Symposium Best Paper Award Fault-aware page address remapping techniques for enhancing yield and reliability of flash memories
- 2018/03/07 - Japan Institute of Electronics Packaging 第31回エレクトロニクス実装学会春季講演大会 電荷注入回数によるIC間配線の試験回路
- 2017/09/23 - IEEE CASS Shikoku Chapter IEEE CASS Shikoku Chapter Best Paper Award Enhanced Built-In Self-Repair Techniques for Improving Fabrication Yield and Reliability of Embedded Memories
- 2017/08/30 - 情報処理学会 SLDM研究会 システムLSI設計技術研究会2016年度 優秀発表学生賞 微小遅延故障テストのためのTDC組込み型スキャンFFの設計について
- 2016/11/29 - 電子情報通信学会 ディペンダブルコンピューティング研究専門委員会 第3回研究会若手優秀講演賞 論理値割当隣接線の選択による断線故障用テスト生成時間の削減
- 2016/03/08 - 国際連携教育開発センター グローバル大学院工学教育賞
- 2014/11/05 - IEEE CPMT Symposium Japan 2014 Young Researcher Award Threshold Value Estimation of Electrical Interconnect Tests with Scan FFs
- 2013/03/07 - Japan Institute of Electronics Packaging 第31回エレクトロニクス実装学会春季講演大会研究奨励賞 電荷注入回数によるIC間配線の試験回路
- 2012/08/29 - 社団法人情報処理学会 システムLSI設計技術研究会 第153回システムLSI設計技術研究会優秀発表学生賞 テストデータ量削減のための反転信号シフト型 BAST 構成とテストパターン生成法
- 2011/06/21 - International Technical Conference on Circuits/Systems, Computers and Communications (ITC-CSCC) Best Paper Award Possibility of Logical Error Caused by Open Defects in TSVs
- 1999/09/10 - 8th Electronic Circuits World Convention The Most Attractive Visual AWARD WINNER Supply Current Testing for Bridging Faults in Microprocessor Based Sequence Control Circuits
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Association Membership(s) (3):
Japan Institute of Electronics Packaging
, IEEE
, Institute of Electronics, Information and Communication Engineers
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