Art

J-GLOBAL ID：200902129541410222   Reference number：96A0711752

Chemical vapor deposition of copper from Cu^I hexafluoroacetylacetonate trimethylvinylsilane for ultralarge scale integration applications.

Cu¹ヘキサフルオロアセチルアセトナトトリメチルビニルシランからの超LSI用の銅の化学蒸着

Author (9)： BRAECKELMANN G (Univ. at Albany-SUNY, New York) ,  MANGER D (Univ. at Albany-SUNY, New York) ,  BURKE A (Univ. at Albany-SUNY, New York) ,  PETERSON G G (Univ. at Albany-SUNY, New York) ,  KALOYEROS A E (Univ. at Albany-SUNY, New York) ,  REIDSEMA C (SEMATECH, Texas) ,  OMSTEAD T R (CVC Products Inc., New York) ,  LOAN J F (MKS Instruments Inc., Massachusetts) ,  SULLIVAN J J (MKS Instruments Inc., Massachusetts)
Material： Journal of Vacuum Science & Technology. B. Microelectronics and Nanometer Structures  (Journal of Vacuum Science & Technology. B. Microelectronics Processing and Phenomena)
Volume： 14  Issue： 3  Page： 1828-1836  Publication year： May. 1996 
JST Material Number： E0974A  ISSN： 1071-1023  CODEN： JVTBD9  Document type： Article
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)

Thesaurus term： Copper ,...
Semi thesaurus term： hexafluoroacetylacetonato ,...

   To see more with JDream III (charged).   {{ this.onShowAbsJLink("http://jdream3.com/lp/jglobal/index.html?docNo=96A0711752&from=J-GLOBAL&jstjournalNo=E0974A") }}

JST classification (2)： Metallic thin films  (BK14030T) ,  Manufacturing technology of solid-state devices  (NC03030V)

Terms in the title (3)： LSI ,  銅 ,  化学蒸着