Art
J-GLOBAL ID:200902134228371171   Reference number:01A0775704

Development of Single Step Grinding System for Large Scale φ300 Si Wafer: A Total Integrated Fixed-Abrasive Solution.

直径300mmシリコンウエハ用の1ステップ研削システムの開発 総集積固定研削砥粒溶液
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Material:
Volume: 50  Issue:Page: 225-228  Publication year: 2001 
JST Material Number: E0026A  ISSN: 0007-8506  Document type: Article
Article type: 原著論文  Country of issue: United Kingdom (GBR)  Language: ENGLISH (EN)
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Grinding  ,  Manufacturing technology of solid-state devices 

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