Machinability of Small Diameter Hole for Circuit Connection in Multi-Layer AFRP Printed Wiring Boards. Comparison between Kevlar Fiber and Thecnora Fiber Reinforcement.

HIROGAKI TOSHIKI; NAKAGAWA HEISABURO; NAKAMURA TAKAHIDE; AOYAMA EIICHI; KATAYAMA TSUTAO; INOUE HISAHIRO

Art

J-GLOBAL ID：200902137828019586 Reference number：02A0247861

Machinability of Small Diameter Hole for Circuit Connection in Multi-Layer AFRP Printed Wiring Boards. Comparison between Kevlar Fiber and Thecnora Fiber Reinforcement.

AFRP多層プリント基板の回路接続用小径穴の加工特性ケブラー繊維およびテクノーラ繊維強化基板の比較

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Material：
Volume： 68 Issue： 666 Page： 258-265 Publication year： Feb. 25, 2002
JST Material Number： F0227B ISSN： 0387-5008 Document type： Article
Article type：原著論文 Country of issue： Japan (JPN) Language： JAPANESE (JA)

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Printed circuits

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