Art

J-GLOBAL ID：200902154007890213   Reference number：02A0442080

Micro Connector for High Packaging Density Fabricated by Using UV Thick Photoresist.

UV厚膜フォトレジストを使って作製した高実装密度用マイクロコネクタ

Author (5)： UNNO T (Ritsumeikan Univ.) ,  TORIYAMA T (New Energy and Industrial Technol.) ,  BHUIYAN M M I (Ritsumeikan Univ.) ,  YOKOYAMA Y (Ritsumeikan Univ.) ,  SUGIYAMA S (Ritsumeikan Univ.)
Material： 電気学会論文誌 E  (IEEJ Transactions on Sensors and Micromachines)
Volume： 122-E  Issue： 5  Page： 249-255  Publication year： May. 01, 2002 
JST Material Number： L3098A  ISSN： 1341-8939  Document type： Article
Article type： 原著論文  Country of issue： Japan (JPN)  Language： ENGLISH (EN)

Thesaurus term： *high density packaging ,...

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JST classification (1)： Connecting parts  (NA05050Z)

Reference (8)：

• ISHII, M. Connector Advanced Technology'99. Japan Advanced Technology. 1999
• MICHEL, F. Mechatronic Micro Devices. Proceedings of the 1999 International Symposium on Micromechatronics and Human Science. 1999, 27-32
• MILLER, D. C. Microrelay Packaging Technology Using Flip-Chip Assembly. Proceedings of MEMS 2000. 2000, 265-270
• OKUYAMA, H. Development of Microconnector with Automatic Connecting/Disconnecting Mechanism. Proceeding of MEMS 1999. 1999, 257-262
• SHARPE, W. N. Jr. Mechanical Properties of LIGA-Deposited Nichel for MEMS Transducers. Digest of Technical Paper of TRANSDUCERS'97. 1997, 1, 607-610

Terms in the title (7)： 厚膜 ,  フォトレジスト ,  作製 ,  実装 ,  密度 ,  マイクロ ,  コネクタ