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J-GLOBAL ID:200902181251965648   Reference number:00A0816864

Evaluation on Numerical Calculation Methods for Fracture Parameters of Interfacial Delaminations in LSI Plastic Packages.

大規模集積回路のパッケージにおける異種材料界面はく離の破壊力学パラメータに関する計算手法の検討
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Volume:Issue:Page: 486-493  Publication year: Sep. 01, 2000 
JST Material Number: S0579C  ISSN: 1343-9677  Document type: Article
Article type: 原著論文  Country of issue: Japan (JPN)  Language: JAPANESE (JA)
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Materials of solid-state devices  ,  Rubber and plastic materials 
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