Art

J-GLOBAL ID：200902214696944735   Reference number：09A0247825

Mechanical properties versus temperature relation of individual phases in Sn-3.0Ag-0.5Cu lead-free solder alloy

Sn-3.0Ag-0.5Cu鉛フリーはんだ中の各個別相の温度関連の機械的性質

Author (4)： GAO Feng (The George W. Woodruff School of Mechanical Engineering, Georgia Inst. of Technol., 801 Ferst Drive NW, MRDC ...) ,  NISHIKAWA Hiroshi (Joining and Welding Res. Inst., Osaka Univ., Osaka 567-0047, JPN) ,  TAKEMOTO Tadashi (Joining and Welding Res. Inst., Osaka Univ., Osaka 567-0047, JPN) ,  QU Jianmin (The George W. Woodruff School of Mechanical Engineering, Georgia Inst. of Technol., 801 Ferst Drive NW, MRDC ...)
Material： Microelectronics Reliability  (Microelectronics and Reliability)
Volume： 49  Issue： 3  Page： 296-302  Publication year： Mar. 2009 
JST Material Number： C0530A  ISSN： 0026-2714  Document type： Article
Article type： 原著論文  Country of issue： United Kingdom (GBR)  Language： ENGLISH (EN)

Thesaurus term： *solder ,  mechanical property ,  silver ,  copper ,  *tin base alloy ,  *temperature dependence ,  *Young's modulus ,  *hardness
Semi thesaurus term： *Pb free solder

JST classification (2)： Brazing  (WC07050C) ,  Measurement,testing and reliability of solid-state devices  (NC03040G)

Terms in the title (2)： 鉛フリーはんだ ,  機械的性質