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J-GLOBAL ID:200902229247408737   Reference number:07A1233196

On-wafer monitoring of charge accumulation and sidewall conductivity in high-aspect-ratio contact holes during SiO2 etching process

SiO2エッチングプロセス中における高アスペクト比コンタクトホールにおける電荷蓄積及び側壁伝導率のオンウエハモニタリング
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Volume: 25  Issue:Page: 1808  Publication year: Nov. 2007 
JST Material Number: E0974A  ISSN: 1071-1023  CODEN: JVTBD9  Document type: Article
Article type: 原著論文  Country of issue: United States (USA)  Language: ENGLISH (EN)
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Manufacturing technology of solid-state devices  ,  Applications of plasma 
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