Electroless Plating of Copper on Metal-Nitride Diffusion Barriers Initiated by Displacement Plating.

WANG Z; IDA T; SAKAUE H; SHINGUBARA S; TAKAHAGI T

Art

J-GLOBAL ID：200902246159628176 Reference number：03A0283282

Electroless Plating of Copper on Metal-Nitride Diffusion Barriers Initiated by Displacement Plating.

金属-窒化物拡散障壁上での銅の置換めっきで始める無電解めっき

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Material：
Volume： 6 Issue： 3 Page： C38-C41 Publication year： Mar. 2003
JST Material Number： W1290A ISSN： 1099-0062 CODEN： ESLEF6 Document type： Article
Article type：短報 Country of issue： United States (USA) Language： ENGLISH (EN)

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Electroless plating , Electrode process

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