Cu Wettability and Diffusion Barrier Property of Ru Thin Film for Cu Metallization

KIM Hoon; KOSEKI Toshihiko; OHBA Takayuki; OHTA Tomohiro; KOJIMA Yasuhiko; SATO Hiroshi; SHIMOGAKI Yukihiro

Art

J-GLOBAL ID：200902251473444563 Reference number：05A0819914

Cu Wettability and Diffusion Barrier Property of Ru Thin Film for Cu Metallization

Cuの濡れ性とCuメタル化用Ru薄膜の拡散障壁特性

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Material：
Volume： 152 Issue： 8 Page： G594-G600 Publication year： 2005
JST Material Number： C0285A ISSN： 1945-7111 CODEN： JESOAN Document type： Article
Article type：原著論文 Country of issue： United States (USA) Language： ENGLISH (EN)

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Solid-solid interface , Materials of solid-state devices

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