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J-GLOBAL ID：200902274436994367   Reference number：09A0257915

Interaction behavior between the additives and Sn in Sn-3.0Ag-0.5Cu-based solder alloys and the relevant joint solderability

Sn-3.0Ag-0.5Cu基ハンダ合金中でのSnと添加元素との間の相互作用挙動および関連する継手のハンダ付性
Author (6)：
CHENG Fangjie

About CHENG Fangjie

(Materials Sci. and Engineering School, Tianjin Univ., Tianjin 300072, CHN)

About Materials Sci. and Engineering School, Tianjin Univ., Tianjin 300072, CHN

, 
CHENG Fangjie

About CHENG Fangjie

(Joining and Welding Res. Inst., Osaka Univ., Osaka 567-0047, JPN)

About Joining and Welding Res. Inst., Osaka Univ., Osaka 567-0047, JPN

, 
GAO Feng

About GAO Feng

(Joining and Welding Res. Inst., Osaka Univ., Osaka 567-0047, JPN)

About Joining and Welding Res. Inst., Osaka Univ., Osaka 567-0047, JPN

, 
GAO Feng

About GAO Feng

(George W. Woodruff School of Mechanical Engineering, Georgia Inst. of Technol., Atlanta 30332-0405, USA)

About George W. Woodruff School of Mechanical Engineering, Georgia Inst. of Technol., Atlanta 30332-0405, USA

, 
NISHIKAWA Hiroshi

About NISHIKAWA Hiroshi

(Joining and Welding Res. Inst., Osaka Univ., Osaka 567-0047, JPN)

About Joining and Welding Res. Inst., Osaka Univ., Osaka 567-0047, JPN

, 
TAKEMOTO Tadashi

About TAKEMOTO Tadashi

(Joining and Welding Res. Inst., Osaka Univ., Osaka 567-0047, JPN)

About Joining and Welding Res. Inst., Osaka Univ., Osaka 567-0047, JPN


Material：
Journal of Alloys and Compounds  (J Alloy Compd)

About Journal of Alloys and Compounds


Volume： 472  Issue： 1-2  Page： 530-534  Publication year： Mar. 20, 2009 
JST Material Number： D0083A  ISSN： 0925-8388  Document type： Article
Article type： 原著論文  Country of issue： Netherlands (NLD)  Language： ENGLISH (EN)
Thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
*tin base alloy

About tin base alloy

, 
silver containing alloy

About silver containing alloy

, 
copper containing alloy

About copper containing alloy

, 
cobalt additive alloy

About cobalt additive alloy

, 
nickel additive alloy

About nickel additive alloy

, 
*solder

About solder

, 
*intermetallic compound

About intermetallic compound

, 
heat treatment

About heat treatment

, 
*peritectic reaction

About peritectic reaction

, 
cooling velocity

About cooling velocity

, 
*weld defect

About weld defect

, 
*metal structure (microstructure)

About metal structure (microstructure)

, 
*brazing joint

About brazing joint

, 
liquidus

About liquidus

, 
weldability

About weldability

, 
short circuit fault

About short circuit fault

, 
*Pb free solder

About Pb free solder

, 
*defect

About defect

, 
*organization

About organization

, 
property

About property


Semi thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
bridging fault

About bridging fault


JST classification (2)：
JST classification
Category name(code) classified by JST.
Brazing 
(WC07050C)

About Brazing

,  Transformation structures,work structures 
(WB01030N)

About Transformation structures,work structures

Terms in the title (7)：
Terms in the title
Keywords automatically extracted from the title.
Sn

About Sn

, 
ハンダ合金

About ハンダ合金

, 
添加元素

About 添加元素

, 
相互作用

About 相互作用

, 
挙動

About 挙動

, 
継手

About 継手

, 
ハンダ付性

About ハンダ付性


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