Art
J-GLOBAL ID：201102250233473819   Reference number：11A1208392

Precise Structure Controlled Plastic Hot Embossing Method for Low-temperature Direct Bonding

低温直接ボンディング用の正確に構造制御したプラスチックホットエンボス方法
Author (3)：
SHINOHARA H.

About SHINOHARA H.

(Waseda Univ., Tokyo, JPN)

About Waseda Univ., Tokyo, JPN

, 
MIZUNO J.

About MIZUNO J.

(Waseda Univ., Tokyo, JPN)

About Waseda Univ., Tokyo, JPN

, 
SHOJI S.

About SHOJI S.

(Waseda Univ., Tokyo, JPN)

About Waseda Univ., Tokyo, JPN


Material：
International Conference on Electronics Packaging (CD-ROM)  (ICEP (CD-ROM))

About International Conference on Electronics Packaging (CD-ROM)


Volume： 2010  Page： ROMBUNNO.FC3-1  Publication year： May. 12, 2010 
JST Material Number： L6010B  Document type： Proceedings
Article type： 原著論文  Country of issue： Japan (JPN)  Language： ENGLISH (EN)
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biochip

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,...
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Thesaurus term/Semi thesaurus term
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*MU-TAS

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JST classification (2)：
JST classification
Category name(code) classified by JST.
Manufacturing technology of solid-state devices 
(NC03030V)

About Manufacturing technology of solid-state devices

,  Biochemical analytical methods 
(EA03030G)

About Biochemical analytical methods

Terms in the title (3)：
Terms in the title
Keywords automatically extracted from the title.
低温

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, 
ボンディング

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, 
構造制御

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