Rchr
J-GLOBAL ID:200901084673021368   Update date: Sep. 19, 2022

Shinohara Hidetoshi

シノハラ ヒデトシ | Shinohara Hidetoshi
Affiliation and department:
Job title: Research Associate
Homepage URL  (2): http://www.shoji.comm.waseda.ac.jp/imprint/index.htmlhttp://www.shoji.comm.waseda.ac.jp/index.html
Research field  (4): Material fabrication and microstructure control ,  Applied physics - general ,  Nano/micro-systems ,  Nanomaterials
Research keywords  (10): インプリント ,  樹脂 ,  接合 ,  マイクロ流体デバイス ,  MEMS ,  imprinting ,  polymer ,  bonding ,  micro-TAS ,  MEMS
Research theme for competitive and other funds  (6):
  • プラスチックの低温直接接合
  • プラスチック製化学分析マイクロチップの作製
  • 有機高分子膜を用いたマイクロ流路内の表面改質
  • Low-temperature direct bonding of thermoplastic polymers
  • Fabrication of plastic microchip for chemical analysis
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MISC (120):
Books (9):
  • Solid State Circuits Technologies, Chapter 22 "Low-temperature Polymer Bonding Using Surface Hydrophilic Treatment for Chemical/bio Microchips” (pp.445-462) http://sciyo.com/articles/show/title/low-temperature-polymer-bonding-using-surface-hydrophilic-・・・
    IN-TECH 2010 ISBN:9789533070452
  • Nanotransfer Science and Technology, Section 4.1 “Company activity”
    KTI-International 2010
  • Nanotransfer Science and Technology, Subsection 3.3.1 “Ubiquitous NIL equipment”
    KTI-International 2010
  • Solid State Circuits Technologies, Chapter 22 "Low-temperature Polymer Bonding Using Surface Hydrophilic Treatment for Chemical/bio Microchips” (pp.445-462) http://sciyo.com/articles/show/title/low-temperature-polymer-bonding-using-surface-hydrophilic-・・・
    IN-TECH 2010 ISBN:9789533070452
  • Nanotransfer Science and Technology, Section 4.1 “Company activity”
    KTI-International 2010
more...
Lectures and oral presentations  (17):
  • Precise Structure Controlled Plastic Hot Embossing Method for Low-temperature Direct Bonding
    (International Conference on Electronics Packaging (ICEP) 2010 2010)
  • Integrated hydrophilic surface treatment system of vapor deposition polymerization and vacuum ultraviolet irradiation for chemical/biochemical microchips
    (The 36th International Conference on Micro and Nano Engineering (MNE 2010) 2010)
  • Studies on Low-temperature Direct Bonding Methods of PMMA and COP Using Surface Pretreatment
    (International Conference on Electronics Packaging (ICEP) 2009 2009)
  • STUDIES ON LOW-TEMPERATURE BONDING MECHANISM OF VUV AND PLASMA PRETREATED CYCLO-OLEFIN POLYMER
    (The 15th International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers2009) 2009)
  • NEXAFS Studies on VUV and Oxygen Plasma Pretreated PMMA Surfaces for Investigation of Low-Temperature Bonding Mechanisms
    (The 22nd International Microprocesses and Nanotechnology Conference (MNC 2009) 2009)
more...
Education (6):
  • - 2010 Waseda University
  • - 2010 Waseda University Graduate School of Advanced Science and Engineering Major in Nano-Science and Nano-Engineering
  • - 2007 Waseda University
  • - 2007 Waseda University Graduate School, Division of Science and Engineering Major in Nano-Science and Nano-Engineering
  • - 2005 Waseda University School of Science and Engineering
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Professional career (1):
  • Doctor of Engineering (Waseda University)
Association Membership(s) (2):
プラスチック成形加工学会 ,  Japan Society of Polymer Processing
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