Art

J-GLOBAL ID：201802256321468087   Reference number：18A1758424

Time-resolved Analysis of Resist Stripping Phenomenon Using Laser Irradiation

レーザ照射を用いたレジスト剥離現象の時間分解解析

Author (6)： Kamimura Tomosumi (Department of Electronics, Information and Communication Engineering, Osaka Institute of Technology) ,  Umeda Yuji (Department of Electronics, Information and Communication Engineering, Osaka Institute of Technology) ,  Kuramae Hiroyuki (Department of Robotics, Osaka Institute of Technology) ,  Nuno Kosuke (Department of Electronics, Information and Communication Engineering, Osaka Institute of Technology) ,  Nakamura Ryosuke (Science & Technology Entrepreneurship Laboratory, Osaka University) ,  Horibe Hideo (Department of Applied Chemistry and Bioengineering, Graduate School of Engineering, Osaka City University)
Material： Journal of Photopolymer Science and Technology  (フォトポリマー懇話会誌)
Volume： 31  Issue： 3  Page： 413-418(J-STAGE)  Publication year： 2018 
JST Material Number： L0202A  ISSN： 0914-9244  CODEN： JSTEEW  Document type： Article
Article type： 原著論文  Country of issue： Japan (JPN)  Language： ENGLISH (EN)

Thesaurus term： measurement ,  exfoliation ,  finite element method ,  laser irradiation ,  efficiency ,  compressive stress ,  optical microscope ,  strength ,  *laser beam machining ,  *resist
Semi thesaurus term： laser intensity ,  レジスト剥離現象 ,  time resolved method ,  removal efficiency ,  delamination

Author keywords (6)： Time-resolved analysis ,  Resist stripping phenomenon ,  Finite element (FE) method ,  Pump laser irradiation ,  Removal efficiency ,  Compressive stress

JST classification (2)： Manufacturing technology of solid-state devices  (NC03030V) ,  Special machining  (QC04000Y)

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Terms in the title (5)： レーザ照射 ,  レジスト ,  剥離現象 ,  分解 ,  解析