Art

J-GLOBAL ID：201802274372361933   Reference number：18A0656462

Microscale Circulation Flow of Slurry in Polishing Pad Asperities -Results of Flow Visualization of Slurry by Using Enlarged Pad Model-

研磨パッド・アスペリティ内のミクロなスラリー循環流れ-拡大パッド模型を使ったスラリー流れの可視化結果-

Author (1)： FUKUDA AKIRA ((独)国立高等専門学校機構 徳山工業高等専門学校)
Material： 精密工学会誌(Web)  (Journal of the Japan Society for Precision Engineering (Web))
Volume： 84  Issue： 2  Page： 182-187(J-STAGE)  Publication year： 2018 
JST Material Number： U0462A  ISSN： 1882-675X  Document type： Article
Article type： 原著論文  Country of issue： Japan (JPN)  Language： JAPANESE (JA)

Thesaurus term： chemical mechanical polishing ,  *cutting tool ,  coated abrasive ,  *asperity ,  *slurry ,  in situ observation ,  chemical species ,  refractive index ,  suspension(disperse system) ,  *polishing(machining) ,  pore ,  circulating flow ,  *flow visualization ,  fluid dynamics ,  scaling law ,  pad
Semi thesaurus term： *polish pad ,  semiconductor circuit fabrication

Author keywords (18)： chemical mechanical polishing ,  polishing pad asperities ,  slurry flow ,  flow visualization ,  scaling law ,  enlarged pad model ,  refractive index matching ,  particle suspension method ,  circulation flow ,  chemical mechanical polishing ,  polishing pad asperities ,  slurry flow ,  flow visualization ,  scaling law ,  enlarged pad model ,  refractive index matching ,  particle suspension method ,  circulation flow

JST classification (1)： Grinding  (QC03000R)

Reference (16)：

• 1) K. Kimura et al.: Study on Material Removal Phenomena in CMP Process, Proceedings of the International Conference on Planarization/CMP Technology 2007 (ICPT2007), (2007) 201.
• 2) K. Kimura et al.: Study on fine particle behavior in slurry flow between wafer and polishing pad as a material removal process in CMP, Proceedings of the International Conference on Planarization/CMP Technology 2012 (ICPT2012), (2012) 345.
• 3) A. Isobe et al.: Proposal of New Polishing Mechanism Based on Feret's Diameter of Contact Area between Polishing Pad and Wafer, Japanese Journal of Applied Physics, 52, 12R, (2013) 126503-1.
• 4) J. Coppeta et al.: Investigating Slurry Transport Beneath a Wafer during Chemical Mechanical Polishing Processes, Journal of the Electrochemical Society, 147, 5, (2000) 1903.
• 5) G. P. Muldowney and D. T. Tselepidakis: A Computational Study of Slurry Flow in Grooved CMP Polishing Pads, Proceedings of 9th International CMP for ULSI Multilevel Interconnection Conference (CMP-MIC), (2004) 147.

Terms in the title (9)： 研磨パッド ,  アスペリティ ,  スラリー ,  循環 ,  流れ ,  拡大 ,  パッド ,  模型 ,  流れの可視化