Art

J-GLOBAL ID：201802289758081080   Reference number：18A1244446

Room-temperature Au-Au bonding in atmospheric air using direct transferred atomically smooth Au film on electroplated patterns

電気めっきパターン上の直接移動原子平滑Au膜を用いた大気中の室温Au-Au結合【JST・京大機械翻訳】

Author (3)： Kurashima Yuichi (National Institute of Advanced Industrial Science and Technology (AIST), 1-2-1 Namiki, Tsukuba, Ibaraki 305-8564, Japan) ,  Matsumae Takashi (National Institute of Advanced Industrial Science and Technology (AIST), 1-2-1 Namiki, Tsukuba, Ibaraki 305-8564, Japan) ,  Takagi Hideki (National Institute of Advanced Industrial Science and Technology (AIST), 1-2-1 Namiki, Tsukuba, Ibaraki 305-8564, Japan)
Material： Microelectronic Engineering  (Microelectron Eng)
Volume： 189  Page： 1-5  Publication year： 2018 
JST Material Number： C0406B  ISSN： 0167-9317  CODEN： MIENEF  Document type： Article
Article type： 原著論文  Country of issue： Netherlands (NLD)  Language： ENGLISH (EN)

Abstract/Point： We demonstrate the direct tran...

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Thesaurus term： bond strength ,  *Electroplating ,  covering ,  transcription ,  thin film ,  *Gold ,  bonding and joining ,  Si wafer ,  adhesion layer

Author keywords (4)： Micro-electromechanical systems (MEMS) ,  Au-Au bonding ,  Room-temperature bonding ,  Atomically smooth surface

JST classification (1)： Manufacturing technology of solid-state devices  (NC03030V)

Terms in the title (5)： 電気めっき ,  原子 ,  Au ,  大気中 ,  室温