Rchr
J-GLOBAL ID：200901066993451028
Update date: Oct. 16, 2023
Takagi Hideki
タカギ ヒデキ | Takagi Hideki
Affiliation and department：
National Institute of Advanced Industrial Science and Technology
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Job title：
Chief Researcher
Homepage URL (1)：
http://www.aist.go.jp/RESEARCHERDB/cgi-bin/worker_detail.cgi?call=namae&rw_id=H59731525
Research field (6)：
Material fabrication and microstructure control
, Electronic devices and equipment
, Mechanics and mechatronics
, Robotics and intelligent systems
, Manufacturing and production engineering
, Thin-film surfaces and interfaces
Research keywords (11)：
凝着
, 表面間力
, MEMS用設計解析支援システム 界面評価
, SAWデバイス 設計製造
, MEMSデバイス
, 常温接合 MEMS
, ウェハ接合
, 熱ナノインプリント 実装技術
, 静電引力インプリント
, ナノインプリント
, MEMS
Research theme for competitive and other funds (2)：
常温ウェハ接合によるマイクロ接合
MEMS
Papers (138)：
Teruhisa Akashi, Hirofumi Funabashi, Hideki Takagi, Yoshiteru Omura, Yoshiyuki Hata. Wafer-level hermetic vacuum packaging by bonding with a copper-tin thin film sealing ring. Journal of Micromechanics and Microengineering. 2018. 28. 4
Hideki Takagi, Yuichi Kurashima, Akifumi Takamizawa, Takeshi Ikegami, Shinya Yanagimachi. Surface activated room-temperature bonding in Ar gas ambient for MEMS encapsulation. Japanese Journal of Applied Physics. 2018. 57. 2
Kurashima, Yuichi, Matsumae, Takashi, Takagi, Hideki. Room-temperature Au-Au bonding in atmospheric air using direct transferred atomically smooth Au film on electroplated patterns. Microelectronic Engineering. 2018. 189. 1-5
Yukio Kashima, Noritoshi Maeda, Eriko Matsuura, Masafumi Jo, Takeshi Iwai, Toshiro Morita, Mitsunori Kokubo, Takaharu Tashiro, Ryuichiro Kamimura, Yamato Osada, et al. High external quantum efficiency (10%) AlGaN-based deep-ultraviolet light-emitting diodes achieved by using highly reflective photonic crystal on p-AlGaN contact layer. APPLIED PHYSICS EXPRESS. 2018. 11. 1
Wen Hsin Chang, Toshifumi Irisawa, Hiroyuki Ishii, Hiroyuki Hattori, Hiroyuki Ota, Hideki Takagi, Yuichi Kurashima, Noriyuki Uchida, Tatsuro Maeda. First Experimental Observation of Channel Thickness Scaling Induced Electron Mobility Enhancement in UTB-GeOI nMOSFETs. IEEE TRANSACTIONS ON ELECTRON DEVICES. 2017. 64. 11. 4615-4621
ｍore...
MISC (7)：
M. M. R. Howlader, S. Suehara, H. Takagi, T. H. Kim, R. Maeda, T. Suga. Room-temperature microfluidics packaging using sequential plasma activation process. IEEE TRANSACTIONS ON ADVANCED PACKAGING. 2006. 29. 3. 448-456
Hideki Takagi, Ryutaro Maeda. Direct bonding of two crystal substrates at room temperature by Ar-beam surface activation. JOURNAL OF CRYSTAL GROWTH. 2006. 292. 2. 429-432
H Takagi, R Maeda. Aligned room-temperature bonding of silicon wafers in vacuum by argon beam surface activation. JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 2005. 15. 2. 290-295
Si/Si, Si/CuのAr高速原子ビームによる表面活性化常温封止接合. 電子情報通信学会論文誌 C エレクトロニクス. 2005. J88-C. 11. 913-919
H Takagi, R Maeda, T Suga. Wafer-scale spontaneous bonding of silicon wafers by argon-beam surface activation at room temperature. SENSORS AND ACTUATORS A-PHYSICAL. 2003. 105. 1. 98-102
ｍore...
Professional career (1)：
博士(工学) (東京大学)
Association Membership(s) (5)：
日本金属学会
, 溶接学会
, 応用物理学会
, エレクトロニクス実装学会
, 精密工学会
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