Masahisa Fujino, Kenji Takahashi, Katsuya Kikuchi, Tetsuya Ueda, Noboru Miyata, Tsukasa Miyazaki. Interfacial analysis of bonded SiCn interfaces by neutron reflectometry. 2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021. 2021. 10
Yuta Takahashi, Masahisa Fujino, Takashi Matsumae, Hiroshi Nakagawa, Katsuya Kikuchi, Tohru Taino. Surface activated bonding of Nb-Nb for surperconducting device interconnect. 2021 International Conference on Electronics Packaging, ICEP 2021. 2021. 21-22
Kazutaka Sueshige, Masahisa Fujino, Tadatomo Suga, Masaaki Ichiki. Transfer of ferroelectric thin film capacitor using internal stress of plated film. IEEJ Transactions on Sensors and Micromachines. 2021. 141. 2. 39-43
Masahisa Fujino, Kenji Takahashi, Katsuya Kikuchi. Wafer-level hybrid bonding for Cu/Interlayer-dielectric bonding. Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. 2019. 44