Influences of Electroless Nickel Film Conditions on Electroless Au/Pd/Ni Wire Bondability

KATO Ikuhiro; KATO Tomohito; TERASHIMA Hajime; WATANABE Hideto; HONMA Hideo

Art

J-GLOBAL ID：201102269191482947 Reference number：11A0162488

Influences of Electroless Nickel Film Conditions on Electroless Au/Pd/Ni Wire Bondability

無電解Au/Pd/Niワイヤボンデイング性への無電解ニッケル膜条件の影響

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Material：
Volume： 3 Issue： 1 Page： 78-85 Publication year： Dec. 24, 2010
JST Material Number： L7297A ISSN： 1883-3365 Document type： Article
Article type：原著論文 Country of issue： Japan (JPN) Language： ENGLISH (EN)

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Materials of solid-state devices

Reference (10)：

H. Haji, “Analysis cases of the wire-bonding interfaces,”Journal of the Surface Finishing Society of Japan, Vol.49, p. 2, 1998.
T. Sugizaki, K. Tajima, T. Sasaki, Y. Fukuda, and T. Kimura, “Effect of Electroless Nickel/Immersion Gold Finishing on BGA solder joints,”Journal of Japan institute of Electronics Packaging, Vol.4, p. 124, 2001.
Y. Watanabe, “Electroless Nickel/Immersion Gold to Enhance the Reliability of the Solder Joint Strength,”Journal of the Surface Finishing Society of Japan, Vol.52, p. 379, 2001.
F. Iwakura, Hyohmen Jissoh Gijutsu, No, 5 pp. 60, 1997 (In Japanease).
A. Chinda, N. Miyamoto, and O. Yoshioka, “Influence of Electroless Gold Plating Thickness on Wire Bondability and Ball, Solderability on Tape Substrate for BGA Packages,”The Journal of the Surface Finishing Society of Japan, Vol.49, No.12, pp. 1291-1297, 1998.

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