Influence of Electroless Gold Plating Thickness on Wire Bondability and Ball Solderability on Tape Substrate for BGA Packages.

CHINDA AKIRA; MIYAMOTO NOBUAKI; YOSHIOKA OSAMU

Art

J-GLOBAL ID：200902151207393401 Reference number：99A0155122

Influence of Electroless Gold Plating Thickness on Wire Bondability and Ball Solderability on Tape Substrate for BGA Packages.

BGAパッケージ用テープ基板における無電解金めっき厚さとワイヤボンディング性およびはんだボール接合性

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Material：
Volume： 49 Issue： 12 Page： 1291-1297 Publication year： Dec. 1998
JST Material Number： G0441B ISSN： 0915-1869 CODEN： HYGIEX Document type： Article
Article type：原著論文 Country of issue： Japan (JPN) Language： JAPANESE (JA)

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Electroless plating , Manufacturing technology of solid-state devices

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