Rchr
J-GLOBAL ID：201601020411395663
Update date: Sep. 18, 2024
Fujino Masahisa
Fujino Masahisa
Affiliation and department：
Job title：
Senior Scientist
Research field (1)：
Electronic devices and equipment
Research theme for competitive and other funds (3)：
- 2023 - 2026 原子層堆積ハイブリッド表面の局所ダイナミクスの解明と3Dヘテロデバイスへの応用
- 2014 - 2017 Transferring Graphene to glass substrate using self-assembled monolayer and nano-adhesion layer
- 2014 - 2017 Development of Low Temperature Bonding Method by Formic Acid Treatment using Pt Catalyst
Papers (92)：
-
Masahisa Fujino, Kenji Takahashi, Katsuya Kikuchi, Tetsuya Ueda, Noboru Miyata, Tsukasa Miyazaki. Interfacial analysis of bonded SiCn interfaces by neutron reflectometry. 2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021. 2021. 10
-
Yuta Takahashi, Masahisa Fujino, Takashi Matsumae, Hiroshi Nakagawa, Katsuya Kikuchi, Tohru Taino. Surface activated bonding of Nb-Nb for surperconducting device interconnect. 2021 International Conference on Electronics Packaging, ICEP 2021. 2021. 21-22
-
Kazutaka Sueshige, Masahisa Fujino, Tadatomo Suga, Masaaki Ichiki. Transfer of ferroelectric thin film capacitor using internal stress of plated film. IEEJ Transactions on Sensors and Micromachines. 2021. 141. 2. 39-43
-
Masahisa Fujino, Kenji Takahashi, Katsuya Kikuchi. Wafer-level hybrid bonding for Cu/Interlayer-dielectric bonding. Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. 2019. 44
-
Pei Wen Chou, Jenn Ming Song, Zong Yu Xie, Masatake Akaike, Tadatomo Suga, Masahisa Fujino, Jing Yuan Lin. Low temperature de-oxidation for copper surface by catalyzed formic acid vapor. Applied Surface Science. 2018. 456. 890-898
ｍore...
MISC (8)：
Professional career (1)：
Work history (6)：
Return to Previous Page
