Art

J-GLOBAL ID：201702212177686066   Reference number：17A1814995

Enhanced Adhesion Strength between Silicon Substrate and Metal Film by Surface Fluorination

表面フッ素化によるシリコン基板と金属フィルムの間の高い接着強度

Author (3)： Nishimura Fumihiro (Department of Materials Science and Engineering, Faculty of Engineering, University of Fukui) ,  Kim Jae-Ho (Department of Materials Science and Engineering, Faculty of Engineering, University of Fukui) ,  Yonezawa Susumu (Department of Materials Science and Engineering, Faculty of Engineering, University of Fukui)
Material： Chemistry Letters  (Chem Lett)
Volume： 46  Issue： 11  Page： 1643-1645(J-STAGE)  Publication year： 2017 
JST Material Number： S0742A  ISSN： 0366-7022  CODEN： CMLTAG  Document type： Article
Article type： 短報  Country of issue： Japan (JPN)  Language： ENGLISH (EN)

Thesaurus term： *surface treatment ,  *fluorination ,  *wafer ,  silicon ,  *metallic thin film ,  *adhesive strength ,  fluorine ,  fluorine addition ,  surface roughness ,  contact angle ,  Nickel ,  scanning electron microscope ,  atomic force microscope ,  X-ray photoelectron spectrum ,  *Si wafer ,  water contact angle
Semi thesaurus term： *silicon substrate ,  silicon ,  metallic film ,  *adhesion strength ,  fluoridation ,  SEM (microscope) ,  AFM (microscope)

Author keywords (3)： Adhesion strength ,  Silicon wafer ,  Fluorination

JST classification (2)： Solid-solid interface  (CB12060M) ,  Bonding  (WC07020V)

Reference (20)：

• 1) Z. J. Pei, G. R. Fisher, J. Liu, Int. J. Mach. Tools Manuf. 2008, 48, 1297.
• 2) G. E. Moore, Electronics (Basel) 1965, 38, 114.
• 3) M.-F. Lai, S.-W. Li, J.-Y. Shih, K.-N. Chen, Microelectron. Eng. 2011, 88, 3282.
• 4) J. Rickerby, J. H. G. Steinke, Chem. Rev. 2002, 102, 1525.
• 5) J. Li, Y. Shacham-Diamand, J. W. Mayer, Mater. Sci. Rep. 1992, 9, 1.

Terms in the title (4)： フッ素化 ,  シリコン基板 ,  金属フィルム ,  接着強度