Art
J-GLOBAL ID:201902246685643495
Reference number:19A1696385
Proposal of a Temperature Rise Estimation Method for Densely Mounted Components
高密度実装部品の温度上昇推定法の提案
Author (8):
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Material:
Volume:
11
Page:
E18-005-1-E18-005-13(J-STAGE)
Publication year:
2018
JST Material Number:
U0592A
ISSN:
1884-8028
Document type:
Article
Article type:
原著論文
Country of issue:
Japan (JPN)
Language:
ENGLISH (EN)
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Semi thesaurus term:
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
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Author keywords (7):
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JST classification (2):
JST classification
Category name(code) classified by JST.
Printed circuits
, Thermometry,thermometer
Reference (12):
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[1] International Electrotechnical Commission, IEC TR 63091:2017, "Study on the derating curve of surface mount fixed resistors - Derating curves based on terminal part temperature," IEC Technical report, 2017.
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[2] M. Ishizuka, "Netsu sekkei gijutsu kaiseki hand book (Thermal design technology and analysis hand book)," pp. 400-403, Mimatsu Co.ltd, 2008.
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[3] W. Nakayama, R. Matsuki, Y. Hacho, and K. Yajima, "A New Role of CFD Simulation in Thermal Design of Compact Electronic Equipment: Application of the Build-up Approach to Thermal Analysis of a Benchmark Model," Journal of Electronic Packaging, Vol. 126, pp. 441-448, 2004.
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[4] H. Yoshino, X. Zhang, and M. Fujii, "Numerical Simulations for Conjugate Heat Transfer from Heat Sources Mounted on a Conductive Wall," 15th Computational Mechanics Division Conference, 2002.
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[5] H. Yoshino, X. Zhang, and M. Fujii, "Conjugate Heat Transfer from Heat Sources Mounted on a Conductive Wall," 39th National Heat Transfer Symposium of Japan, 2002.
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