Art

J-GLOBAL ID：201902246685643495   Reference number：19A1696385

Proposal of a Temperature Rise Estimation Method for Densely Mounted Components

高密度実装部品の温度上昇推定法の提案

Author (8)： Aruga Yoshinori (KOA CORPORATION) ,  Aruga Yoshinori (Toyama Prefectural University) ,  Yamabe Takayuki (KOA CORPORATION) ,  Hirasawa Koichi (KOA CORPORATION) ,  Aoki Hirotoshi (KOA CORPORATION) ,  Hatakeyama Tomoyuki (Toyama Prefectural University) ,  Nakagawa Shinji (Toyama Prefectural University) ,  Ishizuka Masaru (Toyama Prefectural University)
Material： Transactions of the Japan Institute of Electronics Packaging (Web)  (Trans Jpn Inst Electron Packag (Web))
Volume： 11  Page： E18-005-1-E18-005-13(J-STAGE)  Publication year： 2018 
JST Material Number： U0592A  ISSN： 1884-8028  Document type： Article
Article type： 原著論文  Country of issue： Japan (JPN)  Language： ENGLISH (EN)

Thesaurus term： *high density packaging ,  *electronic component ,  *warming ,  *method ,  semiconductor chip ,  heat quantity ,  printed board ,  temperature distribution ,  heat flow ,  Computer Simulation ,  experiment ,  *estimation method ,  numerical experiment ,  LHV ,  computational fluid dynamics ,  computer application ,  utilization ,  fluid dynamics ,  Physics ,  Science ,  Mechanics ,  continuum mechanics ,  natural science
Semi thesaurus term： CFD simulation

Author keywords (7)： Chip Components ,  Dense Mounting ,  Thermal Management ,  Surface Mount ,  Pad Dimensions ,  Thermal Network ,  Estimation Method

JST classification (2)： Printed circuits  (NA05040O) ,  Thermometry,thermometer  (AD06010K)

Reference (12)：

• [1] International Electrotechnical Commission, IEC TR 63091:2017, "Study on the derating curve of surface mount fixed resistors - Derating curves based on terminal part temperature," IEC Technical report, 2017.
• [2] M. Ishizuka, "Netsu sekkei gijutsu kaiseki hand book (Thermal design technology and analysis hand book)," pp. 400-403, Mimatsu Co.ltd, 2008.
• [3] W. Nakayama, R. Matsuki, Y. Hacho, and K. Yajima, "A New Role of CFD Simulation in Thermal Design of Compact Electronic Equipment: Application of the Build-up Approach to Thermal Analysis of a Benchmark Model," Journal of Electronic Packaging, Vol. 126, pp. 441-448, 2004.
• [4] H. Yoshino, X. Zhang, and M. Fujii, "Numerical Simulations for Conjugate Heat Transfer from Heat Sources Mounted on a Conductive Wall," 15th Computational Mechanics Division Conference, 2002.
• [5] H. Yoshino, X. Zhang, and M. Fujii, "Conjugate Heat Transfer from Heat Sources Mounted on a Conductive Wall," 39th National Heat Transfer Symposium of Japan, 2002.

Terms in the title (4)： 高密度実装 ,  温度上昇 ,  推定法 ,  提案