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J-GLOBAL ID：201902290594528109   Reference number：19A2026265

Comparison of Sn-5Sb and Sn-10Sb Alloys in Tensile and Fatigue Properties Using Miniature Size Specimens

ミニチュアサイズ試料を用いた引張および疲労特性におけるSn-5SbおよびSn-10Sb合金の比較【JST・京大機械翻訳】

Author (4)： Kobayashi Tatsuya ( Graduate School of Science and Technology, Gunma University, 1-5-1 Tenjin-cho, Kiryu 376-8515, Japan) ,  Kobayashi Kyosuke ( Graduate School of Science and Technology, Gunma University, 1-5-1 Tenjin-cho, Kiryu 376-8515, Japan) ,  Mitsui Kohei ( Graduate School of Science and Technology, Gunma University, 1-5-1 Tenjin-cho, Kiryu 376-8515, Japan) ,  Shohji Ikuo ( Graduate School of Science and Technology, Gunma University, 1-5-1 Tenjin-cho, Kiryu 376-8515, Japan)
Material： Advances in Materials Science and Engineering (Web)  (Adv Mater Sci Eng (Web))
Volume： 2018  Page： Null  Publication year： 2018 
JST Material Number： U7020A  ISSN： 1687-8434  Document type： Article
Article type： 原著論文  Country of issue： United Kingdom (GBR)  Language： ENGLISH (EN)

Abstract/Point： Tensile and low cycle fatigue ...

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Thesaurus term： yield strength ,  crack propagation ,  fracture testing ,  tensile strength ,  *alloy ,  tensile test ,  ductility ,  warming ,  *tension (material phenomenon) ,  elongation ,  strain rate ,  temperature range ,  *fatigue properties ,  low cycle fatigue ,  mechanical property ,  strength ,  fatigue
Semi thesaurus term： low cycle fatigue ,  破壊挙動 , 【Automatic Indexing@JST】

JST classification (2)： Mechanical properties  (WB02030U) ,  Transformation structures,work structures  (WB01030N)

Reference (20)：

• V. Chidambaram, J. Hattel, J. Hald, "High-temperature lead-free solder alternatives," Microelectronic Engineering, vol. 88, no. 6, pp. 981-989, 2011.
• K. Suganuma, S. J. Kim, K. S. Kim, "High-temperature lead-free solders properties and possibilities," JOM, vol. 61, no. 1, pp. 64-71, 2009.
• T. Yamamoto, K. Tsubone, "Assembly technology using lead-free solder," Fujitsu Scientific and Technical Journal, vol. 43, no. 1, pp. 50-58, 2007.
• Z. Mei, H. A. Holder, H. A. Vander Plas, "Low-temperature solders," Hewlett-Packard Journal, vol. 10, pp. 1-10, 1996.
• J. H. Kim, S. W. Jeong, H. M. Lee, "Thermodynamics-aided alloy design and evaluation of Pb-free solders for high-temperature applications," Materials Transactions, vol. 43, no. 8, pp. 1873-1878, 2002.

Terms in the title (6)： ミニチュア ,  サイズ ,  試料 ,  引張 ,  疲労特性 ,  Sn