Pat
J-GLOBAL ID:202103007948636641
MIS型半導体装置およびその製造方法
Inventor:
,
Applicant, Patent owner:
Gazette classification:特許公報
Application number (International application number):2017079420
Publication number (International publication number):2018182058
Patent number:6941346
Application date: Apr. 13, 2017
Publication date: Nov. 15, 2018
Claim (excerpt):
【請求項1】 半導体層と絶縁体層と導電体層を有し、前記絶縁体層が前記半導体層と前記導電体層で挟まれたMIS型半導体装置であって、
前記絶縁体層はCeF3を含む、MIS型半導体装置。
IPC (3):
H01L 21/336 ( 200 6.01)
, H01L 29/78 ( 200 6.01)
, H01L 21/314 ( 200 6.01)
FI (2):
H01L 29/78 301 G
, H01L 21/314 A
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