Rchr
J-GLOBAL ID:200901009227864538   Update date: Jun. 22, 2024

Higurashi Eiji

ヒグラシ エイジ | Higurashi Eiji
Affiliation and department:
Job title: Professor
Homepage URL  (2): https://www.ecei.tohoku.ac.jp/higurashilab/index.htmlhttps://www.ecei.tohoku.ac.jp/higurashilab/index-e.html
Research field  (5): Electronic devices and equipment ,  Manufacturing and production engineering ,  Composite materials and interfaces ,  Nano/micro-systems ,  Nanomaterials
Research keywords  (33): Heterogeneous Integration ,  Room-temperature bonding ,  Low-temperature bonding ,  bonding interface ,  MEMS Packaging ,  Flip chip bonding ,  Passive alignment ,  Microbump ,  Vacuum sealing ,  Hermetic sealing ,  Microfabrication ,  High-Heat Dissipation Structure ,  Surface activation ,  Atmospheric-pressure plasma ,  Hydrogen radicals ,  Micro system integration ,  Optical MEMS ,  blood flow sensor ,  encoder ,  Photonic Integrated Circuits ,  grating ,  Opto Mechatronics ,  Optical tweezers ,  Wafer bonding ,  3D packaging ,  3D Integration ,  Micromachines ,  Imprint ,  Optical devices ,  Optical micro-devices ,  Sensors ,  Electronics Packaging ,  Electronics packaging
Research theme for competitive and other funds  (10):
  • 2023 - 2026 ナノ界面制御による常温接合基盤技術の創出
  • 2020 - 2021 接合界面付加加工による革新的異種材料低温集積技術の開発
  • 2016 - 2019 Controlling the indium oxide surface by hydrogen radical treatment and its applications
  • 2013 - 2016 Room-temperature bonding of compound semiconductors and its application to high heat dissipation structure
  • 2011 - 2014 New Method for Room Temperature Bonding at Ambient Gas
Show all
Papers (282):
  • Kai Takeuchi, Tadatomo Suga, Eiji Higurashi. Room temperature wafer bonding through conversion of polysilazane into SiO 2. Scientific Reports. 2024. 14. 1
  • Shogo Koseki, Mika Ogino, Kai Takeuchi, Le Hac Huong Thu, Takashi Matsumae, Hideki Takagi, Yuichi Kurashima, Takahiro Tsuda, Tomoaki Tokuhisa, Toshikazu Shimizu, et al. Template Stripping Process Combined With Polyimide and SiO2/Si Templates for Obtaining Smooth Au Surfaces. 2024 International Conference on Electronics Packaging, ICEP 2024. 2024. 129-130
  • Daiki Nemoto, Kai Takeuchi, Eiji Higurashi. Investigation of Plasma Gases for Polysilazane Conversion into SiO2 for Wafer Bonding. 2024 International Conference on Electronics Packaging, ICEP 2024. 2024. 289-290
  • Mika Ogino, Kai Takeuchi, Eiji Higurashi. Influence of Various Plasma and UV/O3Treatments on Au Surfaces for Au-Au Surface Activated Bonding. 2024 International Conference on Electronics Packaging, ICEP 2024. 2024. 331-332
  • Kai Takeuchi, Daiki Nemoto, Tadatomo Suga, Eiji Higurashi. Formation of SiO2 Bonding Interface using Perhydropolysilazane at Room Temperature. 2024 International Conference on Electronics Packaging, ICEP 2024. 2024. 113-114
more...
MISC (352):
  • 蔡元昊, 竹内魁, 魚本幸, 島津武仁, 日暮栄治. Suppression of surface roughening of Ag films by capping layer for Ag/Ag surface activated bonding. エレクトロニクス実装学会講演大会講演論文集(CD-ROM). 2024. 38th. 135-136
  • 小関奨吾, 荻野美佳, 竹内魁, LE Hac Huong Thu, 松前貴司, 高木秀樹, 倉島優一, 津田貴大, 清水寿和, 徳久智明, et al. Surface smoothing of Au plated films by template stripping using polyimide films. エレクトロニクス実装学会講演大会講演論文集(CD-ROM). 2024. 38th
  • 日暮 栄治. 高熱伝導率材料の異種材料集積-Heterogeneous integration of high thermal conductive materials-特集 ヘテロジニアス集積技術と光デバイス応用. Optronics : 光技術コーディネートジャーナル. 2023. 42. 11. 122-127
  • Higurashi Eiji. Heterogeneous Integration Technology Using Low-Temperature Bonding and Its Application to Electronic Devices. Journal of The Japan Institute of Electronics Packaging. 2023. 26. 5. 427-433
  • 日暮 栄治. 研究室だより:東北大学 工学研究科 電子工学専攻 日暮研究室. 電気学会論文誌E(センサ・マイクロマシン部門誌). 2023. 143. 7. NL7_2-NL7_2
more...
Patents (91):
Books (17):
  • 異種材料の接着・接合技術とマルチマテリアル化
    技術情報協会 2017 ISBN:9784861046827
  • 精密加工と微細構造の形成技術
    技術情報協会 2013 ISBN:9784861044830
  • 異種機能デバイス集積化技術の基礎と応用 : MEMS,NEMS,センサ,CMOSLSIの融合
    シーエムシー出版 2012 ISBN:9784781305868
  • fundamentals and applications of MEMS/NEMS engineering
    2009 ISBN:9784924728592
  • 常温接合によるウエハスケールMEMSパッケージ
    須賀唯知 2008
more...
Professional career (1):
  • Ph. D. (Tohoku University)
Work history (14):
  • 2024/04 - 現在 Osaka University Joining and Welding Research Institute Guest Professor
  • 2022/05 - 現在 National Institute of Advanced Industrial Science and Technology (AIST) Visiting Researcher
  • 2022/04 - 現在 Tohoku University Graduate School of Engineering Department of Electronic Engineering Professor
  • 2020/04 - 2022/03 National Institute of Advanced Industrial Science and Technology (AIST) Integrated MEMS Research Group, Device Technology Research Institute Leader, Group
  • 2019/04 - 2020/03 National Institute of Advanced Industrial Science and Technology (AIST) Research Center for Ubiquitous MEMS and Micro Engineering Leader, Team
Show all
Committee career (162):
  • 2024/05 - 現在 Board of Society, The Sensors and Micromachines Society in The Institute of Electrical Engineers of Japan Officer
  • 2024/01 - 現在 IEEE Electronics Packaging Society Board of Governors Members-at-Large
  • 2024/01 - 現在 電気学会第41回「センサ・マイクロマシンと応用システム」シンポジウム実行委員会 委員長
  • 2023/12 - 現在 IEEE CPMT Symposium Japan (ICSJ) General Chair
  • 2023/05 - 現在 エレクトロニクス実装学会北海道・東北支部 委員
Show all
Awards (45):
  • 2022/11 - 電気学会センサ・マイクロマシン部門主催第39回「センサ・マイクロマシンと応用システム」シンポジウム 最優秀技術論文賞 SOIウェハのハイブリッド接合を用いた画素並列3層積層CMOSイメージセンサ
  • 2022/09 - エレクトロニクス実装学会第31回マイクロエレクトロニクスシンポジウム(MES 2021) ベストペーパー賞
  • 2022/01 - Imaging Sensors and Systems 2022 Arnaud Darmont Award for Best Paper
  • 2020/06 - 2019 International Conference on Electronics Packaging (ICEP) JIEP Poster Award
  • 2020/03 - 応用物理学会集積化MEMS技術研究会主催第11回集積化MEMSシンポジウム 優秀論文賞
Show all
Association Membership(s) (6):
IEEE ,  The Institute of Electronics, Information and Communication Engineers (IEICE) ,  The Japan Institute of Electronics Packaging (JIEP) ,  The Japan Society for Precision Engineering (JSPE) ,  The Institute of Electrical Engineers of Japan (IEEJ) ,  The Japan Society of Applied Physics (JSAP)
※ Researcher’s information displayed in J-GLOBAL is based on the information registered in researchmap. For details, see here.

Return to Previous Page