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J-GLOBAL ID:200901009227864538   Update date: Feb. 22, 2025

Higurashi Eiji

ヒグラシ エイジ | Higurashi Eiji
Affiliation and department:
Job title: Professor
Other affiliations (1):
Homepage URL  (2): https://www.ecei.tohoku.ac.jp/higurashilab/index.htmlhttps://www.ecei.tohoku.ac.jp/higurashilab/index-e.html
Research field  (5): Electronic devices and equipment ,  Manufacturing and production engineering ,  Composite materials and interfaces ,  Nano/micro-systems ,  Nanomaterials
Research keywords  (33): Heterogeneous Integration ,  Room-temperature bonding ,  Low-temperature bonding ,  bonding interface ,  MEMS Packaging ,  Flip chip bonding ,  Passive alignment ,  Microbump ,  Vacuum sealing ,  Hermetic sealing ,  Microfabrication ,  High-Heat Dissipation Structure ,  Surface activation ,  Atmospheric-pressure plasma ,  Hydrogen radicals ,  Micro system integration ,  Optical MEMS ,  blood flow sensor ,  encoder ,  Photonic Integrated Circuits ,  grating ,  Opto Mechatronics ,  Optical tweezers ,  Wafer bonding ,  3D packaging ,  3D Integration ,  Micromachines ,  Imprint ,  Optical devices ,  Optical micro-devices ,  Sensors ,  Electronics Packaging ,  Electronics packaging
Research theme for competitive and other funds  (11):
  • 2024 - 2026 Creation of fundamental technology on room-temperature bonding through nano-interface control
  • 2023 - 2026 ナノ界面制御による常温接合基盤技術の創出
  • 2020 - 2021 接合界面付加加工による革新的異種材料低温集積技術の開発
  • 2016 - 2019 Controlling the indium oxide surface by hydrogen radical treatment and its applications
  • 2013 - 2016 Room-temperature bonding of compound semiconductors and its application to high heat dissipation structure
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Papers (290):
  • Kai Takeuchi, Shogo Koseki, Le Hac Huong Thu, Takashi Matsumae, Hideki Takagi, Yuichi Kurashima, Takahiro Tsuda, Tomoaki Tokuhisa, Toshikazu Shimizu, Eiji Higurashi. Room temperature bonding of Au plating through surface smoothing using polyimide template stripping. Sensors and Actuators A: Physical. 2025
  • Kai Takeuchi, Eiji Higurashi. Room temperature wafer bonding via polysilazane for vacuum sealing bonding. Japanese Journal of Applied Physics. 2025
  • Kai Takeuchi, Tadatomo Suga, Eiji Higurashi. Room temperature wafer bonding through conversion of polysilazane into SiO 2. Scientific Reports. 2024. 14. 1. 1267-1267
  • Nemoto Daiki, Kai Takeuchi, Eiji Higurashi. Plasma Hydrophilic Treatment for Improved Wafer Bonding Strength via Polysilazane. 2024 International 3D Systems Integration Conference, 3DIC 2024. 2024
  • Shintaro Goto, Kai Takeuchi, Le Hac Huong Thu, Takashi Matsumae, Hideki Takagi, Yuichi Kurashima, Eiji Higurashi. Au Flat Micro-Bump Arrays Fabricated by Transfer and Coining of Au Thin Films. 2024 8th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2024. 2024
more...
MISC (365):
  • K. H. Chang, J. H. Lai, T. F. Pan, H. H. Chiu, A. Boudrioua, C. M. Lai, H. Yokoyama, E. Higurashi, H. Akiyama, L. H. Peng. Nonlinear mode converted with multi-color spectral composites. JSAP-Optica Joint Symposia, JSAP 2024 in Proceedings JSAP-Optica Joint Symposia 2024 Abstracts. 2024
  • Eiji Higurashi. Message from the General Chair. 13th IEEE CPMT Symposium Japan: Innovation of Packaging Technology for Advanced Heterogeneous Integration, ICSJ 2024. 2024
  • 小関奨吾, 竹内魁, 日暮栄治, LE Thu Hac Huong, 松前貴司, 高木秀樹, 倉島優一, 津田貴大, 徳久智明, 清水寿和. Template Stripping Process Combined With Polyimide and SiO2 Templates for Obtaining Smooth Au Surfaces. センサ・マイクロマシンと応用システムシンポジウム(CD-ROM). 2024. 41st
  • 後藤慎太郎, 竹内魁, 日暮栄治, LE Hac Huong Thu, 松前貴司, 高木秀樹, 倉島優一. Fabrication of hollow micro-bump arrays by Au thin film transfer. センサ・マイクロマシンと応用システムシンポジウム(CD-ROM). 2024. 41st
  • 荻野美佳, 竹内魁, 日暮栄治. Room-temperature bonding of wafers with Au thin films using sequential surface treatment by VUV light and Ar plasma. センサ・マイクロマシンと応用システムシンポジウム(CD-ROM). 2024. 41st
more...
Patents (93):
Books (20):
  • 次世代高速・高周波伝送部材の開発動向
    技術情報協会 2024 ISBN:9784867980545
  • 次世代パワーデバイスに向けた高耐熱・高放熱材料の開発と熱対策 ~基板・接合・封止・冷却技術~
    技術情報協会 2024 ISBN:9784867980309
  • 半導体・磁性体・電池の固/固界面制御と接合・積層技術
    S&T出版株式会社 2024 ISBN:9784911146040
  • 異種材料の接着・接合技術とマルチマテリアル化
    技術情報協会 2017 ISBN:9784861046827
  • 精密加工と微細構造の形成技術
    技術情報協会 2013 ISBN:9784861044830
more...
Professional career (1):
  • Ph. D. (Tohoku University)
Work history (16):
  • 2024/04 - 現在 Osaka University Joining and Welding Research Institute Guest Professor
  • 2022/05 - 現在 National Institute of Advanced Industrial Science and Technology (AIST) Visiting Researcher
  • 2022/04 - 現在 Tohoku University Faculty of Engineering Department of Electrical,Information and Physics Engineering Professor
  • 2022/04 - 現在 Tohoku University Research Institute of Electrical Communication Professor
  • 2022/04 - 現在 Tohoku University Graduate School of Engineering Department of Electronic Engineering Professor
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Committee career (196):
  • 2025/01 - 現在 電気学会 第42回「センサ・マイクロマシンと応用システム」シンポジウム実行委員会 顧問
  • 2024/12 - 現在 14th IEEE CPMT Symposium Japan (ICSJ2025) Steering Committee
  • 2024/07 - 現在 2025 International Conference on Electronics Packaging (ICEP2025) Technical Program Committee Member
  • 2024/07 - 現在 Japan Electronics and Information Technology Industries Association (JEITA) Observer
  • 2024/05 - 現在 Board of Society, The Sensors and Micromachines Society in The Institute of Electrical Engineers of Japan Officer
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Awards (46):
  • 2024/11 - 電気学会センサ・マイクロマシン部門主催第41回「センサ・マイクロマシンと応用システム」シンポジウム 優秀ポスター発表賞ファイナリスト 無機ポリマーを用いた水中でのSi基板間の接着
  • 2022/11 - 電気学会センサ・マイクロマシン部門主催第39回「センサ・マイクロマシンと応用システム」シンポジウム 最優秀技術論文賞 SOIウェハのハイブリッド接合を用いた画素並列3層積層CMOSイメージセンサ
  • 2022/09 - エレクトロニクス実装学会第31回マイクロエレクトロニクスシンポジウム(MES 2021) ベストペーパー賞
  • 2022/01 - Imaging Sensors and Systems 2022 Arnaud Darmont Award for Best Paper
  • 2020/06 - 2019 International Conference on Electronics Packaging (ICEP) JIEP Poster Award
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Association Membership(s) (6):
IEEE ,  The Institute of Electronics, Information and Communication Engineers (IEICE) ,  The Japan Institute of Electronics Packaging (JIEP) ,  The Japan Society for Precision Engineering (JSPE) ,  The Institute of Electrical Engineers of Japan (IEEJ) ,  The Japan Society of Applied Physics (JSAP)
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