Phase Growth Model and Application to Thermal Cyclic Loading in Sn/Pb Eutectic Solder Joints.
Sn/Pb共晶はんだ接合部における相成長モデルと熱サイクル負荷への適用
Publisher site
{{ this.onShowPLink() }}
Copy service
{{ this.onShowCLink("http://jdream3.com/copy/?sid=JGLOBAL&noSystem=1&documentNoArray=01A0662603©=1") }}
Volume:
4
Issue:
4
Page:
298-305
Publication year:
Jul. 01, 2001
JST Material Number:
S0579C
ISSN:
1343-9677
Document type:
Article
Article type:
原著論文
Country of issue:
Japan (JPN)
Language:
JAPANESE (JA)
Thesaurus term:
Thesaurus term/Semi thesaurus term Keywords indexed to the article. All keywords is available on JDreamIII(charged). On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
To see more with JDream III (charged).
{{ this.onShowAbsJLink("http://jdream3.com/lp/jglobal/index.html?docNo=01A0662603&from=J-GLOBAL&jstjournalNo=S0579C") }}
JST classification (2):
JST classification
Category name(code) classified by JST.