M. Moriyama, Y. Suzuki, K. Totsu, H. Hirano, S, Tanaka. Isolation Characteristics of In-plane Feedthrough across Au/SiOx Seal Ring for Wafer-level RF MEMS Packaging. APCOT 2018. 2018. 24-27
K. Tanaka, H. Hirano, M. Kumano, J. Froemel, S. Tanaka. Bonding-Based Wafer-Level Vacuum Packaging Using Atomic Hydrogen Pre-Treated Cu Bonding Frames. Micromachines. 2018. 9. 4. 181
Integration of BST Varactors on Lithium Niobate by Film Transfer Technology for Tunable SAW Filters
(International Symposium on Acoustic Wave Devices for Future Mobile Communication Systems 2012)