Art

J-GLOBAL ID：201202272140513366   Reference number：12A0238759

Reliability Enhancement of Thick Al-Cu Wire Bonds in IGBT Modules Using Al₂Cu Precipitates

Al₂Cu析出物を使用したIGBTモジュールの太いAlCuワイヤボンドの信頼性向上

Author (7)： KUROSU Toshiki (Power and Industrial Div., Hitachi Ltd.) ,  KUROSU Toshiki (Graduate School of Sci. and Engineering, Ibaraki Univ.) ,  KHOO Khyoupin (Dep. of Materials Sci., Fac. of Engineering, Ibaraki Univ.) ,  NAKAMURA Yoshihide (Graduate School of Sci. and Engineering, Ibaraki Univ.) ,  OZAKI Keisuke (Graduate School of Sci. and Engineering, Ibaraki Univ.) ,  ISHIKAWA Nobuhiro (The National Inst. for Materials Sci.) ,  ONUKI Jin (Dep. of Materials Sci., Fac. of Engineering, Ibaraki Univ.)
Material： Materials Transactions  (Mater Trans)
Volume： 53  Issue： 2  Page： 453-456 (J-STAGE)  Publication year： 2012 
JST Material Number： G0668A  ISSN： 1345-9678  Document type： Article
Article type： 原著論文  Country of issue： Japan (JPN)  Language： ENGLISH (EN)

Thesaurus term： *precipitate (phase separation) ,  *IGBT ,  intermetallic compound ,  module ,  *wire bonding ,  aluminum containing alloy ,  *copper base alloy ,  reliability (property) ,  grain boundary ,  heat cycle ,  thermal expansion ,  wafer ,  crack propagation ,  metal wire ,  Aluminum ,  crack initiation ,  grain boundary precipitation ,  matrix (base) ,  *aluminum base alloy ,  copper containing alloy ,  electric automobile ,  motor ,  Si wafer
Semi thesaurus term： silicon substrate

JST classification (1)： Measurement,testing and reliability of solid-state devices  (NC03040G)

Reference (13)：

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• 4) Y. Shimizu, Y. Tomota, J. Onuki, K. P. Khoo and T. Kurosu: Jpn. J. Appl. Phys. 48 (2009) 066511.
• 5) T. Kurosu, Y. Shimizu, Y. Tomota and J. Onuki: Mater. Trans. 52 (2011) 102–107.

Terms in the title (6)： 析出物 ,  IGBT ,  モジュール ,  ワイヤ ,  ボンド ,  信頼性向上