Research keywords (9):
High Density Packaging Technology
, Composite Plating
, Electroless Plating
, ElectroPlating
, Nanotechnology
, Electronic Packaging Technology
, Plating
, Electrochemistry
, Chemistry
International Society of Electrochemistry
, THE MATERIALS RESEARCH SOCIETY OF JAPAN
, Electrochemical Society
, THE ADHESION SOCIETY OF JAPAN
, THE JAPAN INSTITUTE OF ELECTRONICS PACKAGING
, THE SURFACE FINISHING SOCIETY OF JAPAN
, THE JAPAN SOCIETY OF APPLIED PHYSICS
, THE ELECTROCHEMICAL SOCIETY OF JAPAN
, THE CHEMICAL SOCIETY OF JAPAN